Terminal Assembly with Selective Solderability Regions
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Solution Overview
Problem
Existing technologies face challenges in making reliable, non-permanent electrical connections between substrates, particularly with Ball Grid Array (BGA) packages, which are difficult to replace or interchange once soldered to a printed circuit board.
Innovation Solution
The development of an intercoupling component with an electrically conductive terminal assembly, featuring a core member obstructing an axial hole, where the core member and terminal body have different solderability materials, allowing for secure and removable connections between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If BGA packages are soldered directly to printed circuit board, then electrical connection reliability is improved, but interchangeability and replaceability deteriorate
Solution Approach 1:
The invention divides the connection system into three separate components: the BGA package, the intercoupling component with terminal assembly, and the printed circuit board. This segmentation allows the BGA package to be soldered to the intercoupling component rather than directly to the PCB, enabling the intercoupling component to be removed and replaced while leaving the BGA package intact, thus resolving the contradiction between connection reliability and interchangeability.
2Reliability
If core member obstructs the axial hole, then solder flow control is improved, but manufacturing complexity increases
Solution Approach 1:
The core member is selectively positioned within the axial hole to obstruct only the specific region where solder flow needs to be controlled. This local intervention prevents solder from flowing along the peripheral sides of the terminal body while maintaining simplicity in the overall manufacturing process, as the core member can be a simple cylindrical or conical component inserted into the existing hole structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable, non-permanent electrical connections between substrates, reducing manufacturing costs through selective plating and assembly, while maintaining effective solderability and preventing solder flow along peripheral sides during reflow.
Implementation Method 1
the first material having greater solderability than the second material
Data Source
AI summary
An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.