Acoustic Wave Chip Ground Bump Layout for Attenuation and Resin Filling
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Solution Overview
Problem
Existing acoustic wave devices face challenges in achieving optimal attenuation characteristics and resin filling properties due to uniform bump heights leading to deteriorated performance.
Innovation Solution
Differentially heightening and numbering ground bumps on acoustic wave chips to improve attenuation characteristics and resin filling properties, with shorter bumps on fewer chips and taller bumps on more chips, ensuring improved resin coverage and reduced attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the height of the bumps is increased, then the bonding strength between acoustic wave chips and substrate is improved, but the attenuation characteristics deteriorate
Solution Approach 1:
The patent applies local quality by differentiating bump heights based on their functional roles. Ground bumps are made shorter to maintain good attenuation characteristics, while signal bumps are made taller to ensure adequate bonding strength and electrical connection. This localized differentiation allows each bump type to be optimized for its specific function without compromising the other.
Solution Approach 2:
The patent segments the bonding bumps into two distinct categories: ground bumps and signal bumps. This segmentation allows for independent optimization of each type's height parameter. Ground bumps are designed with one height range specifically for maintaining attenuation characteristics, while signal bumps use a different height range for ensuring bonding strength, thereby resolving the contradiction through functional segmentation.
2Object-generated harmful factors
If the height of the bumps is decreased, then the attenuation characteristics are improved, but the resin filling property deteriorates
Solution Approach 1:
The patent applies local quality by assigning different height characteristics to different bump types. Ground bumps are designed shorter to ensure excellent attenuation characteristics, while signal bumps are designed taller to provide sufficient space for resin filling and encapsulation. This localized differentiation resolves the contradiction by allowing each bump type to be optimized for its primary function.
Solution Approach 2:
The patent segments the bump structure into ground bumps and signal bumps with different height specifications. This segmentation enables the ground bumps to be optimized for attenuation (shorter height) while signal bumps are optimized for resin filling (taller height), thereby simultaneously achieving both attenuation improvement and adequate resin filling without compromise.
3Ease of manufacture
If uniform bump heights are used for all acoustic wave chips, then the manufacturing process is simplified, but the attenuation characteristics and resin filling properties cannot be optimized simultaneously
Solution Approach 1:
The patent applies local quality by differentiating bump heights based on their functional roles. Ground bumps are made shorter to maintain good attenuation characteristics, while signal bumps are made taller to ensure adequate bonding strength and electrical connection. This localized differentiation allows each bump type to be optimized for its specific function without compromising the other.
Solution Approach 2:
The patent segments the bonding bumps into two distinct categories: ground bumps and signal bumps. This segmentation allows for independent optimization of each type's height parameter. Ground bumps are designed with one height range specifically for maintaining attenuation characteristics, while signal bumps use a different height range for ensuring bonding strength, thereby resolving the contradiction through functional segmentation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances both attenuation characteristics and resin filling properties by varying bump heights and numbers, optimizing device performance.
Implementation Method 1
a plurality of first bumps bonding the substrate to the first acoustic wave chip, and a plurality of second bumps bonding the substrate to the second acoustic wave chip
Implementation Method 2
an acoustic wave device in which a plurality of piezoelectric element chips are mounted on a substrate
Data Source
AI summary
An acoustic wave device includes a first acoustic wave chip and a second acoustic wave chip mounted on a substrate, first bumps bonding the first acoustic wave chip to the substrate and including first ground bumps connected to a ground potential, second bumps bonding the second acoustic wave chip to the substrate and including second ground bumps connected to a ground potential. When a number of the first ground bumps is n1, a number of the second ground bumps is n2, a height of the first ground bumps is h1, and a height of the second ground bumps is h2, n1<n2 and h1<h2.