Impedence Networks TRIZ Cases
- Substrate-Integrated MEMS Resonator Layout for Compact Clock Routing
Embedding a MEMS resonator within the substrate below a processor cuts package size, shortens clock routing, and reduces parasitics.
- RF Module Ground Shield Structure for Compact Signal Isolation
A grounded metal shield between RF circuit components suppresses electromagnetic coupling, preserves signal quality, and enables smaller module layouts.
- Protective Conductor Structure for Sn Bump Leakage Control
A protective layer on the conductor limits Sn bump leakage during reflow, preserving bump thickness for reliable flip-chip bonding.
- Surface-Mount RF Bias Tee With Planar Bias Path for Low AC Perturbance
A planar bias path and thin-film resistor shrink RF bias tee footprint while minimizing AC perturbances for compact high-frequency mounting.
- Integrated Sheet-Metal Filter Unit for Compact 5G Low-Loss Suppression
Electroplated sheet-metal resonators with local dielectric coating merge low-pass and band-pass filtering to cut size while improving out-of-band suppression.
- Common Mode Filter Coil Layout for Lower Inter-Wire Capacitance
Non-overlap coil sections cut inter-wire capacitance in stacked conductor layers, improving high-frequency response and lowering insertion loss.
- Multilayer Dielectric Filter Layout for Sintering Stress Relief
A stepped multilayer body delays shrinkage mismatch between resonator and non-resonator regions, preventing cracks and deformation.
- AlGaN Laser Lift-Off for Damage-Free GaN Substrate Stripping
Laser irradiation selectively decomposes an AlGaN layer to detach the substrate while preserving the GaN functional layer and improving peeling quality.
- Microwave Dielectric Metallization for Uniform Low-Roughness Copper
Ion implantation, arc plasma deposition, and electroplating create smooth, uniform copper layers with strong adhesion on complex microwave dielectric parts.
- Integrated PM Motor Harmonic Filtering for HVAC Compressors
An in-housing toroidal filter cuts PM motor harmonic distortion in HVAC compressors while reducing external wiring, cost, and cooling load.
- Mo Barrier Solder Bonding Structure for Reflow Interface Strength
A Mo barrier layer with a Ni, Ag, Au, or Cu bonding layer suppresses metal reactions during reflow and preserves solder joint interface strength.
- Photodiode-HEMT-SAW Chip Structure Using Shared Schottky and Ohmic Contacts
Shared Schottky and Ohmic contacts integrate photodiode, HEMT, and SAW regions on one chip to lower fabrication cost and keep high-speed operation.
- Compartmentalized Module Shielding for EMI Isolation
Segmented submodule shielding connects to a continuous module shield to isolate radiative components and reduce EMI without added size or complexity.
- Pad Protective Wiring Layout for ESD and Capacitance Control
A resistor-coupled protective wiring layout discharges ESD while limiting pad-to-circuit capacitance in compact ICs with circuits under pads.
- Micro-Acoustic Filtenna Integration for Low-Loss RF Filtering
By coupling micro-acoustic resonators to an antenna, this filtenna cuts transmission-line loss, improves signal fidelity, and saves RF space.
- Multilayer Strip-Line RF Filter Module for Wider Passband
A multilayer strip line adds integrated inductance to widen an RF filter passband without extra coils or larger module size.
- Plasma-Modified Bonded Substrates for Void-Free Strong Interfaces
Plasma-treated modified layers enable temporary bonding and annealing to suppress voids and strengthen quartz and lithium tantalate or niobate interfaces.