Resonator Assembly With Damping Bonding for Stable Frequency
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Solution Overview
Problem
Resonator devices face challenges in miniaturization due to issues with conductive bonding members, such as conductive adhesives causing short circuits and metal bumps leading to unstable oscillation frequencies due to assembly variations and poor resonation damping.
Innovation Solution
A resonator device design incorporating metal bumps for electrical coupling and a bonding member with a higher loss tangent than the metal bumps to absorb unnecessary resonation energy, reducing leakage and stabilizing oscillation frequencies, while maintaining miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive adhesive is used as the conductive bonding member, then electrical coupling between mount electrode and internal terminal is achieved, but device area increases due to required terminal spacing to prevent short circuits
Solution Approach 1:
The patent introduces a metal bump as an intermediary bonding member between the mount electrode and internal terminal. This metal bump mediator enables electrical coupling while requiring minimal spacing, thus preventing short circuits without increasing device area. The metal bump serves as a precise, controlled conductive path that eliminates the need for large clearance zones required by conductive adhesives.
Solution Approach 2:
The patent changes the physical parameters of the bonding member from a soft, expandable conductive adhesive to a rigid metal bump with controlled dimensions. This parameter change allows for precise terminal spacing optimization, enabling compact device layout while maintaining reliable electrical coupling and preventing short circuits through the rigid structural properties of metal.
2Area of stationary object
If metal bump is used as the conductive bonding member, then device area is reduced, but oscillation frequency becomes unstable due to high rigidity and poor resonation damping
Solution Approach 1:
The patent applies local quality by positioning damping structures (such as damping pads or viscoelastic materials) specifically at critical locations near the resonator element where vibration energy needs to be absorbed. This localized damping approach maintains the overall compact metal bump structure for small device area while adding targeted resonation damping capability to stabilize oscillation frequency without requiring large device dimensions.
3Manufacturing precision
If rigid bonding structure is used, then assembly precision is maintained, but resonation leakage increases causing unstable oscillation frequency
Solution Approach 1:
The patent employs composite material structures combining rigid metal bump components for precise electrical coupling with integrated damping materials (such as viscoelastic polymers or damped metal alloys) that absorb resonation energy. This composite approach maintains assembly precision through the rigid metal structure while simultaneously reducing resonation leakage through the energy-absorbing damping materials, thereby stabilizing oscillation frequency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves stable frequency characteristics and improved impact resistance, enabling a compact and high-performance resonator device with reduced resonation leakage and enhanced reliability.
Implementation Method 1
A loss tangent of the bonding member at a room temperature is larger than a loss tangent of the first metal bump and the second metal bump at a room temperature
Data Source
AI summary
A resonator device includes: a resonator element that has a first surface on which a first mount electrode and a second mount electrode are disposed, and a second surface; a base that has a third surface which faces the first surface of the resonator element and on which a first base electrode and a second base electrode are disposed; a lid that has a fourth surface which faces the second surface of the resonator element; a first metal bump by which the first mount electrode and the first base electrode are bonded; a second metal bump by which the second mount electrode and the second base electrode are bonded; and a bonding member by which the second surface and the fourth surface are bonded. A loss tangent of the bonding member is larger than a loss tangent of the first metal bump and the second metal bump.