Compartmentalized Module Shielding for Internal EMI Isolation
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Solution Overview
Problem
There is a need for an improved shielded electronic module design that can reduce electromagnetic interference (EMI) with the external environment and individually isolate radiative components within the module, while also being manufactured in a cost-effective manner without increasing the size and complexity of the final product.
Innovation Solution
The shielded electronic module includes a module shielding structure and an electronic module with an interposer, a first shielded electronic submodule, and a module mold compound. The submodule side shielding structure covers the side surface of the electronic submodule, and the module shielding structure directly and continuously covers the top and side surfaces of the electronic module, ensuring electrical connection and individual shielding of the submodule.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a traditional grounded enclosure shield is used to cover the entire circuit module, then electromagnetic interference (EMI) with the external environment is reduced, but the size and complexity of the module increases
Solution Approach 1:
The patent divides the shielding structure into two segments: a submodule shielding structure that covers individual radiative components, and a module shielding structure that covers the entire module. This segmentation allows shielding to be applied only where necessary, reducing overall complexity while maintaining EMI protection.
Solution Approach 2:
The patent applies shielding selectively to local areas rather than uniformly across the entire module. The submodule shielding structure is positioned specifically over radiative components that generate EMI, providing localized protection without enclosing the entire module, thus reducing size and complexity.
2Object-generated harmful factors
If a traditional grounded enclosure shield is used to cover the entire circuit module, then electromagnetic emissions are blocked, but the manufacturing cost increases
Solution Approach 1:
The shielding structure is segmented into separate submodule and module levels, allowing for modular manufacturing. The submodule shielding structures can be manufactured and attached independently, reducing overall manufacturing complexity and cost compared to a single large enclosure shield.
Solution Approach 2:
By applying shielding only to specific radiative components rather than the entire module, the amount of shielding material required is reduced, and the manufacturing process is simplified, leading to lower production costs.
3Object-generated harmful factors
If individual radiative components are isolated within the module, then internal EMI is reduced, but the device complexity increases
Solution Approach 1:
The patent segments the module into multiple submodules, each containing radiative components that are isolated from one another. The submodule shielding structures create individual containment zones without requiring a complex overall internal structure, as each submodule is independently shielded.
Solution Approach 2:
The submodule shielding structures are nested within the larger module shielding structure, creating a hierarchical shielding arrangement. This nesting approach allows individual component isolation without adding significant external complexity, as the submodules fit within the overall module framework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI with the external environment and isolates radiative components within the module, while being manufactured in a cost-effective way without increasing the size and complexity of the final product.
Implementation Method 1
When electromagnetic emissions from electronic components within the shield strike the interior surface of the shield, the electromagnetic emissions are electrically shorted through the grounded conductive material
Implementation Method 2
The module shielding structure directly and continuously covers the top surface and the side surface of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the first electronic submodule
Implementation Method 3
the electromagnetic emissions are electrically shorted through the grounded conductive material, thereby reducing emissions
Data Source
AI summary
The disclosure relates to a shielded electronic module which includes a module shielding structure and an electronic module with an interposer, a shielded electronic submodule over the interposer, and a module mold compound over the interposer and encapsulating sides of the shielded electronic submodule. Herein, the shielded electronic submodule includes an electronic submodule and a submodule side shielding structure, which covers sides of the electronic submodule to provide the sides of the shielded electronic submodule. A top surface of the electronic module is a combination of a top surface of the module mold compound and a top surface of the shielded electronic submodule, which is not covered by the module mold compound. The module shielding structure directly and continuously covers the top surface and sides of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the electronic submodule.