Acoustic Wave Filter Package for High Power and Passband Stability

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Solution Overview

Problem

Existing wireless communication systems face challenges in miniaturization and cost reduction due to the large size and high production costs of metallic and ceramic cavity waveguide filters, and acoustic wave filters struggle with power handling capability and temperature-induced passband drift.

Innovation Solution

A filter package is designed with multiple metal layers, parallel-connected acoustic wave filters, power dividing and combining components, and heat dissipating structures to achieve high-power operation while minimizing passband drift and size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If metallic and ceramic cavity waveguide filters are used to achieve high-power operation, then power handling capability is improved, but device size and production cost increase

Engineering Contradiction:

Improvepower handling capabilityVSAvoiddevice size

Core Design Contradiction:

PowerVSVolume of moving object

Solution Approach 1:

The filter is divided into multiple acoustic wave filter units connected in parallel, each handling a portion of the total power. This segmentation allows the system to achieve high power handling capability while using smaller, more compact filter units compared to a single large metallic or ceramic cavity filter.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs a composite structure combining acoustic wave filters with specific substrate materials and interconnection structures. This composite approach enables the filter to achieve high-power operation through the collective behavior of multiple parallel units while maintaining a compact form factor, avoiding the need for large metallic or ceramic cavities.

Inventive Principle:

Principle #40Composite materials

2Power

If metallic and ceramic cavity waveguide filters are used to achieve high-power operation, then power handling capability is improved, but production cost increases

Engineering Contradiction:

Improvepower handling capabilityVSAvoidproduction cost

Core Design Contradiction:

PowerVSEase of manufacture

Solution Approach 1:

By segmenting the filter into multiple parallel acoustic wave filter units, the system can use standardized, lower-cost components that are easier to manufacture and assemble compared to complex metallic or ceramic cavity structures. This modular approach reduces production costs while achieving the required power handling capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses multiple copies of the same acoustic wave filter unit connected in parallel. This copying approach allows for standardized manufacturing processes and mass production of identical units, significantly reducing production costs compared to custom-manufactured metallic or ceramic cavity filters.

Inventive Principle:

Principle #26Copying

3Power

If acoustic wave filters operate at high power, then power handling capability is improved, but temperature-induced passband drift increases

Engineering Contradiction:

Improvepower handling capabilityVSAvoidpassband stability

Core Design Contradiction:

PowerVSStability of the object's composition

Solution Approach 1:

By dividing the total power across multiple parallel acoustic wave filter units, the power density and heat generation in each individual unit is reduced. This segmentation helps maintain passband stability by minimizing temperature-induced drift in each unit while achieving high overall power handling capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces heat dissipating structures as intermediary elements between the acoustic wave filters and the surrounding environment. These structures act as thermal mediators, efficiently conducting heat away from the filter units to maintain stable operating temperatures and prevent passband drift during high-power operation.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Power

If multiple acoustic wave filters are connected in parallel to achieve high-power operation, then power handling capability is improved, but device complexity increases

Engineering Contradiction:

Improvepower handling capabilityVSAvoidfilter package structure

Core Design Contradiction:

PowerVSDevice complexity

Solution Approach 1:

The patent merges multiple acoustic wave filter units, power dividing components, power combining components, and heat dissipating structures into a single integrated filter package. This combining approach achieves high power handling capability through parallel connections while managing overall complexity through unified packaging and integrated thermal management.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables high-power operation with reduced size and cost, addressing temperature-induced performance deterioration and facilitating miniaturization of communication devices.

Implementation Method 1

heat dissipating components

Methodology Applied

Scientific EffectHeat dissipation: Conduction (thermal)

Data Source

PatentUS20250323619A1High-power acoustic wave filter package capable of self-heat dissipation

Publication Date: 2025.10.16 SAMSUNG ELECTRONICS CO LTD

AI summary

A filter package is provided. The filter package includes a plurality of metal layers stacked in a vertical direction, a plurality of acoustic wave filters connected in parallel, the plurality of acoustic wave filters being located at one of the plurality of metal layers, power dividing and combining components connected with the plurality of acoustic wave filters, and heat dissipating components.