High-Frequency Module Ground Electrode Layout for Heat Dissipation
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Solution Overview
Problem
The existing high-frequency modules have insufficient heat dissipation performance for electronic components, which can lead to thermal issues and reduced efficiency in communication devices.
Innovation Solution
A high-frequency module design that includes a mounting board with a first electronic component, a first resin layer covering the component's outer surface, and a first ground electrode connected to a second ground electrode inside the board, facilitating heat dissipation through the ground electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a filter is disposed on a module board with a resin layer covering its lateral surfaces, then the filter is protected and electrically isolated, but the heat dissipation performance becomes insufficient
Solution Approach 1:
The invention divides the heat dissipation function into multiple segments: the resin layer provides electrical isolation while the metal film layer provides thermal conduction. This segmentation allows each layer to perform its specialized function without interfering with the other, resolving the contradiction between electrical isolation and heat dissipation.
Solution Approach 2:
The resin layer serves multiple functions: it provides electrical isolation between the filter and surrounding components, mechanical protection for the filter, and serves as an adhesive layer. The metal film similarly provides both thermal conduction and electrical grounding functions, demonstrating multi-functionality that resolves the heat dissipation issue while maintaining reliability.
2Temperature
If a metal film is added to improve heat dissipation, then thermal management improves, but the device complexity increases
Solution Approach 1:
The invention merges the heat dissipation function with the existing grounding structure by making the metal film extend to connect with the ground electrode. This combination allows the metal film to serve dual purposes: heat dissipation and electrical grounding, thereby improving thermal management without significantly increasing device complexity.
Solution Approach 2:
The metal film acts as an intermediary between the filter (heat source) and the ground electrode (heat sink). It mediates the thermal energy transfer from the filter to the ground electrode, enabling efficient heat dissipation while maintaining a relatively simple structural configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat dissipation performance for the electronic components, enhancing the thermal management and operational efficiency of the high-frequency module and communication devices.
Implementation Method 1
The first ground electrode is connected to the second ground electrode. The mounting board includes a second ground electrode inside the mounting board. The first ground electrode covers at least a part of the first resin layer. A principal surface of the first electronic component opposite to the mounting board is connected to the first ground electrode.
Data Source
AI summary
A high-frequency module includes a mounting board, a first electronic component, a first resin layer, and a first ground electrode. The mounting board has a first principal surface and a second principal surface facing each other. The first electronic component is disposed on the first principal surface of the mounting board. The first resin layer is disposed on the first principal surface of the mounting board, and covers at least a part of an outer peripheral surface of the first electronic component. The first ground electrode covers at least a part of the first resin layer. A principal surface of the first electronic component opposite to the mounting board is connected to the first ground electrode. The mounting board includes a second ground electrode inside the mounting board. The first ground electrode is connected to the second ground electrode.