Surface-Mount RF Bias Tee With Planar Bias Path for Low AC Perturbance
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Solution Overview
Problem
Conventional bias tee components are large and cumbersome, making them difficult to integrate into small, high-frequency radio signal communication systems due to their high profile and large footprint, which is exacerbated by wire wound inductors.
Innovation Solution
A surface mount component with a monolithic substrate and thin-film resistors and conductive traces, featuring narrow cross-sectional areas and widths to minimize AC perturbances, allowing for compact integration and DC bias adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire wound inductors are used in bias tee components, then the DC bias adjustment function is achieved, but the component size increases significantly with high profile and large footprint
Solution Approach 1:
The patent replaces wire wound inductors with planar spiral inductors formed by conducting traces on a substrate. This substitution eliminates the mechanical three-dimensional wire winding structure and replaces it with a two-dimensional planar structure, achieving the same inductive function while dramatically reducing the component footprint and profile height.
Solution Approach 2:
The invention transitions from a three-dimensional wire wound inductor to a two-dimensional planar spiral inductor on a substrate. By changing the dimensional approach from vertical wire winding to horizontal planar tracing, the component achieves its inductive function within a much smaller footprint area while maintaining the required electrical characteristics.
2Reliability
If conventional wire wound inductors are used in bias tee components, then the DC bias adjustment function is achieved, but the component profile height increases significantly
Solution Approach 1:
The patent replaces wire wound inductors with planar spiral inductors formed by conducting traces on a substrate. This substitution eliminates the mechanical three-dimensional wire winding structure and replaces it with a two-dimensional planar structure, achieving the same inductive function while dramatically reducing the component footprint and profile height.
Solution Approach 2:
The invention transitions from a three-dimensional wire wound inductor to a two-dimensional planar spiral inductor on a substrate. By changing the dimensional approach from vertical wire winding to horizontal planar tracing, the component achieves its inductive function within a much smaller footprint area while maintaining the required electrical characteristics.
3Area of stationary object
If miniaturization is pursued for surface mount components, then the component footprint is reduced, but the difficulty of surface mounting increases
Solution Approach 1:
The invention transitions from a three-dimensional wire wound inductor to a two-dimensional planar spiral inductor on a substrate. By changing the dimensional approach from vertical wire winding to horizontal planar tracing, the component achieves its inductive function within a much smaller footprint area while maintaining the required electrical characteristics.
Solution Approach 2:
The patent integrates multiple functions into a single planar structure on a substrate. The spiral inductor, resistors, and DC bias adjustment elements are all merged into one compact planar component, simplifying the manufacturing process and making surface mounting easier despite the miniaturized size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact surface mount component with reduced AC perturbances, enabling efficient DC bias adjustment in a small footprint suitable for high-frequency radio signal communication systems.
Implementation Method 1
A thin-film resistor can be connected in a DC bias path between the DC bias terminal and the signal path
Implementation Method 2
A conductive trace can be formed over a surface of the monolithic substrate included in a signal path between the input terminal and the output terminal
Data Source
AI summary
A surface mount component can include a monolithic substrate, an input terminal, an output terminal, and a DC bias terminal. Each terminal can be formed over the monolithic substrate. A conductive trace can be formed over a surface of the monolithic substrate included in a signal path between the input terminal and the output terminal. A thin-film resistor can be connected in a DC bias path between the DC bias terminal and the signal path. The DC bias path can have, at one or more locations along the DC bias path between the DC bias terminal and the signal path, a cross-sectional area in a plane that is perpendicular to the surface of the monolithic substrate. The cross-sectional area of the DC bias path can be less than about 1,000 square microns.