Covered Monolithic Filter Shielding for EMI-Stable Bandpass
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Solution Overview
Problem
Passive filter devices are adversely affected by electromagnetic radiation, necessitating a filter with improved shielding to maintain performance.
Innovation Solution
A filter configuration featuring a monolithic substrate with conductive layers, a cover layer, and a shield layer that provides excellent electromagnetic shielding, allowing for fine-tuning of performance characteristics such as band pass frequency range and out-of-band rejection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a passive filter device is used, then it can filter select frequency ranges from an electric signal, but electromagnetic radiation adversely affects its performance
Solution Approach 1:
A cover layer is introduced as an intermediary element between the conductive layers and the external environment. This cover layer physically shields the conductive layers from electromagnetic radiation while allowing the filter to maintain its frequency selection function, thus resolving the contradiction between filter performance and electromagnetic radiation interference
2Reliability
If shielding is added to protect against electromagnetic radiation, then filter performance is improved, but device complexity increases
Solution Approach 1:
The shield layer is merged with the existing conductive layers of the filter, creating an integrated structure where the shielding function is combined with the filtering function. This reduces overall device complexity by eliminating separate shielding components while maintaining electromagnetic protection and filter performance
3Object-affected harmful factors
If a cover layer and shield layer are added, then electromagnetic shielding is improved, but manufacturing complexity increases
Solution Approach 1:
The shielding structure is segmented into distinct functional layers: a cover layer that provides primary physical shielding and a shield layer with conductive paths that provides electromagnetic grounding. This segmentation allows each layer to be optimized independently for its specific function while simplifying the overall manufacturing process through modular construction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The filter exhibits improved performance with a narrow band pass frequency range and steep rate of decrease in insertion loss, effectively shielding against electromagnetic interference and maintaining performance for frequencies above 10 GHz.
Implementation Method 1
a shield layer that connects with one or more of the at least one conductive layer at one or more of the first top edge or the second top edge of the monolithic substrate. The shield layer can include a first portion formed over the first side surface of the cover layer, a second portion formed over the top surface of the cover layer, and a third portion formed over the second side surface of the cover layer
Implementation Method 2
A first conductive layer can be formed over the top surface of the monolithic substrate. The first conductive layer can include a first plurality of resonator arms. A second conductive layer can be formed over the top surface of the monolithic substrate. The second conductive layer can include a second plurality of resonator arms interdigitated with the first plurality of resonator arms of the first conductive layer
Data Source
AI summary
A filter can include a monolithic substrate and at least one conductive layer formed over a top surface of the monolithic substrate and along at least a portion of one or more of a first top edge of the monolithic substrate or a second top edge of the monolithic substrate. A cover layer can be arranged over the top surface of the monolithic substrate. A shield layer can connect with one or more of the conductive layer(s) at the first top edge or the second top edge of the monolithic substrate. The shield layer can include a first portion formed over the first side surface of the cover layer, a second portion formed over the top surface of the cover layer, and a third portion formed over the second side surface of the cover layer.