Stacked Inductance Structure for Higher Inductance in Less Space
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Solution Overview
Problem
The increasing demand for higher inductance values and reduced size in electronic devices, particularly with the expansion of 5G technology, necessitates the development of inductance structures that can efficiently handle wider signal frequencies while maintaining a compact form factor.
Innovation Solution
An inductance structure is designed with a dielectric substrate having connection through-holes and conductive structures on opposite surfaces, connected by electrodes to form a coil, where one conductive structure has at least three sub-layers and the other has at least one sub-layer, with overlapping orthographic projections and parallel current flow directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional planar inductance structures are used, then the device size can be kept small, but the inductance value is insufficient for 5G signal transmission requirements
Solution Approach 1:
The patent transitions from a traditional planar (2D) inductance structure to a three-dimensional stacked structure by adding multiple conductive layers at different heights. The first conductive structure is disposed on the first surface of the dielectric substrate, while the second conductive structure is disposed on the second surface, creating vertical stacking that increases inductance value without proportionally increasing footprint area.
Solution Approach 2:
The patent implements nested positioning where the orthographic projection of the second conductive structure overlaps with the orthographic projection of the first conductive structure. This nested arrangement allows the conductive structures to be vertically stacked with horizontal overlap, maximizing space utilization and increasing inductance density within a compact footprint.
2Quantity of substance
If multi-layer conductive structures are implemented to increase inductance, then inductance value improves, but preparation complexity and cost increase
Solution Approach 1:
The patent divides the conductive structure into multiple discrete layers (first conductive structure with first conductive sub-layer, second conductive structure with second conductive sub-layer) separated by dielectric substrates. Each layer can be independently formed and connected through through-holes, allowing modular fabrication and simplifying the preparation process despite the multi-layer complexity.
Solution Approach 2:
The dielectric substrate acts as an intermediary element that electrically isolates and mechanically supports the conductive structures. The connection through-holes penetrating the dielectric substrate provide electrical connection between layers, serving as intermediaries that simplify the overall assembly process by providing standardized connection points between the first and second conductive structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances inductance value and density per unit volume, reducing the structure's size without increasing preparation difficulty or cost, thus supporting higher-performance devices in smaller form factors.
Implementation Method 1
connection electrodes are provided in the connection through-holes; the first conductive structure and the second conductive structure are electrically connected by the connection electrodes to form a coil
Implementation Method 2
orthographic projections of two of the sub-layers of the first conductive structure and the second conductive structure on the dielectric substrate at least partially overlap, and flow directions of currents of the two of the sub-layers are roughly parallel
Data Source
AI summary
An inductance structure and a filter, and relates to the technical field of passive devices. The inductance structure includes a dielectric substrate, a first conductive structure and a second conductive structure; the dielectric substrate is provided with a plurality of connection through-holes penetrating in a thickness direction thereof; connection electrodes are provided in the connection through-holes; the first conductive structure and the second conductive structure are electrically connected by the connection electrodes to form a coil of the inductance structure; one of the first conductive structure and the second conductive structure includes at least three sub-layers, and the other includes at least one sub-layer; and orthographic projections of two of the sub-layers of the first conductive structure and the second conductive structure on the dielectric substrate at least partially overlap, and the flow directions of currents of both are roughly parallel.