Piezoelectric Resonator Packaging for Compact Power Converter ICs
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Solution Overview
Problem
Conventional power converters with inductors have a large footprint and profile due to the size of the inductor, which limits their power density and compactness.
Innovation Solution
The integration of a piezoelectric resonator with a bridge circuit in a packaged IC, where the piezoelectric resonator is mounted over a semiconductor die on a package substrate, reduces the overall size and profile of the power converter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If an inductor is used in a power converter, then the power converter can store and release energy, but the footprint and profile height become large
Solution Approach 1:
The patent replaces the traditional magnetic inductor with a piezoelectric resonator that uses piezoelectric effect (mechanical-vibrational energy storage) instead of magnetic fields. The piezoelectric resonator stores energy through mechanical vibrations in the piezoelectric material, fundamentally substituting the magnetic energy storage mechanism with a mechanical vibration-based mechanism, thereby achieving compact size while maintaining power conversion capability
Solution Approach 2:
The patent changes the energy storage mechanism from magnetic field parameters (inductance, magnetic flux) to piezoelectric parameters (resonant frequency, mechanical vibration amplitude, piezoelectric coefficient). By operating the piezoelectric resonator at its resonant frequency, energy is stored efficiently through mechanical vibrations, allowing for dramatically reduced component size compared to traditional inductors while maintaining the required power handling capability
2Power
If an inductor is used in a power converter, then the power converter can store and release energy, but the profile height increases
Solution Approach 1:
The patent replaces the traditional magnetic inductor with a piezoelectric resonator that uses piezoelectric effect (mechanical-vibrational energy storage) instead of magnetic fields. The piezoelectric resonator stores energy through mechanical vibrations in the piezoelectric material, fundamentally substituting the magnetic energy storage mechanism with a mechanical vibration-based mechanism, thereby achieving compact size while maintaining power conversion capability
Solution Approach 2:
The patent transitions from the planar footprint dimension to vertical stacking in the Z-dimension by mounting the piezoelectric resonator over the semiconductor die. This three-dimensional integration allows the energy storage function to be achieved in the vertical dimension rather than expanding horizontally, reducing the overall footprint while managing profile height through layered construction
3Area of stationary object
If a piezoelectric resonator is integrated over the semiconductor die, then the footprint is reduced, but the height/profile increases
Solution Approach 1:
The patent implements nested integration by placing the piezoelectric resonator directly over the semiconductor die, with the resonator housing containing the piezoelectric element, electrodes, and support structures. This nesting arrangement allows multiple functional components to occupy overlapping three-dimensional space, maximizing space utilization and achieving compact overall dimensions by eliminating wasted space between components
Solution Approach 2:
The patent transitions from the planar footprint dimension to vertical stacking in the Z-dimension by mounting the piezoelectric resonator over the semiconductor die. This three-dimensional integration allows the energy storage function to be achieved in the vertical dimension rather than expanding horizontally, reducing the overall footprint while managing profile height through layered construction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes the increase in height/profile while reducing the footprint, thereby enhancing the power density of the power converter compared to traditional inductor-based designs.
Implementation Method 1
A piezoelectric resonator is on the metal support structures and over the semiconductor die
Data Source
AI summary
A packaged integrated circuit (IC) includes a package substrate having opposing first and second surfaces. The package substrate includes first and second metal pads on the first surface, third metal pads on the second surface, and metal interconnects coupled between the third metal pads and at least some of the first and second metal pads. A semiconductor die is on the first surface and is coupled to the first metal pads. Metal support structures are on the first surface and are coupled to a at least some of the second metal pads. A piezoelectric resonator is on the metal support structures and over the semiconductor die. A cap is on the package substrate and covers the piezoelectric resonator, the metal support structures, and the semiconductor die.