Crystal Oscillator Thermal Insulation for Stable Oven Control
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Solution Overview
Problem
Oven controlled crystal oscillators face stability challenges in harsh outdoor environments due to temperature variations, limiting their performance in 5G network applications.
Innovation Solution
A crystal oscillator design incorporating a resonator hermetically encapsulated with a low-thermal conductivity glue and a heating element, where the glue also wraps the heating element to minimize thermal resistance and maintain temperature stability, reducing power consumption and frequency variation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermostatic oven is used in outdoor environments, then temperature control is provided, but temperature stability deteriorates under harsh ambient conditions
Solution Approach 1:
The patent introduces a low-thermal-conductivity glue as an intermediary material between the resonator and the external environment. This mediator blocks thermal pathways, preventing ambient temperature fluctuations from directly affecting the resonator, thus maintaining temperature stability in outdoor environments.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the encapsulation material by using low-thermal-conductivity glue instead of conventional materials. This parameter change reduces heat transfer between the resonator and the external environment, improving temperature stability under varying ambient conditions.
2Temperature
If heating element is added to control temperature, then temperature control is improved, but thermal resistance between resonator and heating element increases
Solution Approach 1:
The patent applies different thermal conductivity properties to different regions: the low-thermal-conductivity glue is used specifically in the encapsulation layer surrounding the resonator to block external heat, while the heating element maintains direct thermal contact with the resonator through the same glue, creating a localized thermal pathway that minimizes resistance where needed.
3Reliability
If low-thermal conductivity glue is used to wrap resonator, then temperature variation is suppressed, but power consumption increases
Solution Approach 1:
The low-thermal-conductivity glue acts as a thermal intermediary that reduces the need for continuous heating by blocking external temperature fluctuations. This mediator maintains a more stable thermal environment, allowing the heating element to operate at lower power levels while still achieving the required temperature stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal stability and reduced frequency change (ΔF) across varying temperatures, enhancing oven stability and reducing power consumption, as demonstrated by a frequency change of 15 ppb compared to 43 ppb in comparative examples.
Implementation Method 1
The low-thermal conductivity glue wraps the resonator to suppress temperature variation in the resonator
Implementation Method 2
the heating element is configured to supply heat to the resonator
Data Source
AI summary
A crystal oscillator and an oscillating device are provided. The crystal oscillator includes a resonator, a low-thermal conductivity glue, an integrated circuit chip, and a heating element. In the resonator, a crystal blank is hermetically encapsulated. The low-thermal conductivity glue wraps the resonator to suppress temperature variation in the resonator. The integrated circuit chip is disposed below the resonator, and the heating element is configured to supply heat to the resonator.