Quartz Crystal Wafer Tilted-Surface Etching for Variable Cut Angles
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Solution Overview
Problem
The existing method for manufacturing quartz crystal substrates with different cutting angles is complex and costly, as it requires preparing multiple artificial quartz crystals for each cutting angle, making it inefficient and time-consuming, especially when the demand for specific cutting angles is low.
Innovation Solution
A method involving the preparation of a quartz crystal wafer with a predetermined cutting angle, where resist films are formed and dry-etched to create tilted surfaces, allowing for the production of quartz crystal substrates with different cutting angles, such as SC-cut, from a single AT-cut wafer, thereby simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple artificial quartz crystals are prepared for different cutting angles, then quartz crystal substrates with different cutting angles can be manufactured, but the manufacturing process becomes complicated and the number of wafers required increases
Solution Approach 1:
The invention makes a single quartz crystal wafer perform multiple functions by enabling it to produce substrates with different cutting angles through sequential processing. The wafer is first processed to create a first tilted surface, then a second tilted surface is created on the same wafer, allowing one wafer to generate multiple product variants that previously required separate wafers
Solution Approach 2:
The manufacturing process is segmented into distinct stages: first creating a first tilted surface with a first cutting angle, then creating a second tilted surface with a second cutting angle on the same wafer. This segmentation allows different cutting angles to be produced from a single wafer through sequential processing steps rather than requiring separate wafers for each angle
2Adaptability or versatility
If multiple artificial quartz crystals are prepared for different cutting angles, then substrates with different cutting angles can be obtained, but manufacturing costs increase
Solution Approach 1:
A single quartz crystal wafer is made universal by enabling it to produce multiple substrate types with different cutting angles. The wafer undergoes first processing to create a first tilted surface, then second processing to create a second tilted surface, allowing one wafer to replace multiple wafers that would have been needed for different cutting angles
Solution Approach 2:
The invention recovers value from the quartz crystal wafer by extracting multiple usable substrates with different cutting angles from a single wafer. Instead of discarding the wafer after one use, the process extracts additional substrates with different tilting angles, maximizing the utilization of each wafer and reducing the total number of wafers required
3Quantity of substance
If a single quartz crystal wafer is used for different cutting angles, then the number of wafers is reduced, but the cutting precision and regularity decrease
Solution Approach 1:
The invention performs preliminary processing to create a first tilted surface with precise cutting angle before proceeding to create the second tilted surface. This preliminary action establishes a foundation that enables subsequent precise processing, ensuring that even though multiple cutting angles are produced from one wafer, each cutting angle maintains high precision through sequential controlled processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces costs, and allows for the production of quartz crystal substrates with different cutting angles from a single wafer, addressing the complexity and inefficiency of traditional methods by eliminating the need for dedicated wafers for each cutting angle.
Implementation Method 1
forming a first tilted surface tilted with respect to the first surface by dry-etching the quartz crystal wafer from the first surface side, forming a second tilted surface tilted with respect to the second surface by dry-etching the quartz crystal wafer from the second surface side
Data Source
AI summary
A method of manufacturing a quartz crystal element includes preparing a quartz crystal wafer having a predetermined cutting angle with respect to a crystal axis of a quartz crystal, forming a first resist film having a first tilted part on a first surface of the quartz crystal wafer and dry-etching the first resist film with the quartz crystal, forming a first tilted surface by dry-etching the quartz crystal wafer from the first surface side, forming a second resist film having a second tilted part on a second surface of the quartz crystal wafer and dry-etching the second resist film with the quartz crystal, and forming a second tilted surface tilted by dry-etching the quartz crystal wafer from the second surface side. The quartz crystal element provided with the first tilted surface and the second tilted surface, and having a cutting angle different from the predetermined cutting angle is formed.