FBAR Cavity Structure to Minimize Parasitic Electrode Overlap

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Solution Overview

Problem

Current film bulk acoustic resonator (FBAR) structures face challenges in minimizing parasitic capacitance and improving the quality factor (Q) and electromechanical coupling coefficient due to overlapping electrode areas outside the cavity, which affects their performance in high-frequency applications.

Innovation Solution

The FBAR structure incorporates a cavity formed by a dielectric layer, bonding substrate, and bottom cap wafer, with edges of the bottom electrode and vertical projections of the top electrode positioned within the cavity to minimize overlap and parasitic capacitance, along with raised structures and passivation layers to enhance electrical connections and resonator performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the electrode area is increased to improve electrical connection, then the Q factor and electromechanical coupling coefficient are enhanced, but parasitic capacitance increases due to overlapping electrode areas outside the cavity

Engineering Contradiction:
ImproveQ factor and electromechanical coupling coefficientVSAvoidparasitic capacitance
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent segments the electrode structure by introducing a cavity that divides the electrode area into an effective area (within the cavity) and a non-effective area (outside the cavity). This segmentation allows the effective area to contribute to the Q factor and electromechanical coupling coefficient while minimizing the non-effective area that generates parasitic capacitance. The cavity acts as a spatial separator that optimizes the functional distribution of the electrode area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by creating raised structures at specific locations (edges of the cavity) that locally enhance the electrode area for effective coupling while controlling the overall overlap. The raised structures provide localized improvement in electrical connection quality without proportionally increasing parasitic capacitance, as they are positioned to maximize effective area utilization.

Inventive Principle:
Principle #3Local quality

2Object-generated harmful factors

If the overlapping electrode area is reduced to minimize parasitic capacitance, then electrical connection and resonator performance are improved, but the effective resonator area is also reduced

Engineering Contradiction:
Improveparasitic capacitanceVSAvoideffective resonator area
Core Design Contradiction:
Object-generated harmful factorsVSArea of moving object

Solution Approach 1:

The patent introduces a vertical dimension by creating raised structures that extend upward from the substrate surface at the cavity edges. This dimensional change allows the electrode area to be increased in the vertical direction without proportionally increasing the horizontal overlap area that generates parasitic capacitance. The raised structures provide additional effective area for coupling while maintaining control over the parasitic capacitance-generating overlap.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested structure where the cavity is formed within the substrate, and the raised structures are positioned at the cavity edges. This nesting arrangement allows the effective resonator area to be maximized within the cavity boundaries while the raised structures provide additional coupling area that does not proportionally increase the parasitic overlap, creating a nested optimization of area utilization.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces parasitic capacitance, enhances the Q factor and electromechanical coupling coefficient, and improves the frequency response of FBAR filters by minimizing non-effective resonator area overlap, resulting in higher performance and reduced energy leakage.

Implementation Method 1

A film bulk acoustic resonator (FBAR) is a device including a thin film that is made of a piezoelectric material and disposed between two electrodes

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

a cavity disposed below the bottom electrode and formed by the dielectric layer, the bonding substrate, and the bottom cap wafer

Methodology Applied
Scientific EffectAcoustic wave confinement: Resonance

Data Source

PatentUS12088276B2Method of manufacturing an FBAR structure
Publication Date: 2024.09.10 SHENZHEN NEWSONIC TECH CO LTD
  • US12088276B2 patent drawing
  • US12088276B2 patent drawing
  • US12088276B2 patent drawing

AI summary

A method for forming a film bulk acoustic resonator (FBAR) structure includes: sequentially forming a top electrode layer, a piezoelectric layer, and a bottom electrode layer on a first substrate; patterning the bottom electrode layer to form a bottom electrode; forming a dielectric layer on the bottom electrode; bonding a bonding substrate onto the dielectric layer; removing the first substrate; patterning the top electrode layer to form a top electrode; forming an opening in the bonding substrate; selectively removing a portion of the dielectric layer to form a cavity; and bonding a bottom cap wafer onto the bonding substrate to seal the cavity.