BAW Filter Electrodes Using TiN Nucleation for LiNbO3 Epitaxy

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Solution Overview

Problem

Current methods for producing bulk acoustic wave (BAW) filters with lithium niobate-based piezoelectric layers on silicon substrates face challenges in achieving high crystalline quality and controlled stoichiometry while being cost-effective, with existing solutions like Smart-Cut transfer methods being costly and ZnO-based buffer layers resulting in non-monocrystalline layers with adhesion and etching issues.

Innovation Solution

A method involving the epitaxial growth of lithium niobate or lithium tantalum-based piezoelectric layers on a silicon substrate using a nitride-based electrically conductive refractory material as a nucleation layer, which blocks lithium diffusion and maintains stoichiometry, and is compatible with silicon technology, allowing for high-quality BAW filter production without a transfer step.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the Smart-Cut transfer method is used to manufacture BAW filters with LiNbO3 piezoelectric layer, then the crystalline quality and coupling coefficient are improved, but the manufacturing complexity and cost increase significantly

Engineering Contradiction:
Improvecrystalline qualityVSAvoidmanufacturing complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the complex transfer step from the manufacturing process. Instead of using the Smart-Cut transfer method which requires separating LiNbO3 from a donor substrate and transferring it to a receiver substrate, the invention directly synthesizes the LiNbO3 piezoelectric layer on the silicon-based substrate, removing the unnecessary intermediate transfer operation while maintaining crystalline quality.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent applies preliminary action by forming a carefully engineered buffer layer structure (including nucleation layers and intermediate layers) before synthesizing the LiNbO3 piezoelectric layer. This preliminary buffer layer structure prepares the silicon substrate in advance to support direct epitaxial growth of high-quality LiNbO3, eliminating the need for subsequent transfer operations.

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If a ZnO-based buffer layer is used to synthesize LiNbO3 piezoelectric layer on silicon substrate, then the synthesis is simplified, but the crystalline quality deteriorates and adhesion problems occur

Engineering Contradiction:
Improvesynthesis simplicityVSAvoidcrystalline quality
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent changes the material composition and structural parameters of the buffer layer. Instead of using a simple ZnO buffer layer, the invention employs a multi-layer buffer structure with specific materials (such as AlN, SiN, or TiN) and controlled thicknesses. This parameter optimization enables direct synthesis of monocrystalline LiNbO3 with high crystalline quality while maintaining adhesion to the silicon substrate.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite buffer layer structures combining multiple materials with complementary properties. The buffer layer may include combinations such as AlN/SiN/TiN or other multi-layer compositions that provide both the crystalline template for LiNbO3 growth and the adhesion interface with silicon, achieving both synthesis simplicity and high crystalline quality.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If a ZnO-based buffer layer is used for LiNbO3 synthesis, then the synthesis process is simplified, but etching compatibility and adhesion are worsened

Engineering Contradiction:
Improvesynthesis process simplicityVSAvoidadhesion and etching compatibility
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the material selection for the buffer layer to achieve better etching compatibility. The buffer layer materials are specifically chosen to be etchable by standard semiconductor etching processes, enabling reliable formation of cavities and trenches. This parameter optimization ensures that the buffer layer can be selectively removed when needed while maintaining strong adhesion between the LiNbO3 piezoelectric layer and the silicon substrate.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a stoichiometric and high-crystalline quality piezoelectric layer that is compatible with silicon technology, enabling the production of high-frequency BAW filters with improved performance and reduced manufacturing costs, and is integrable with other microelectronic devices.

Implementation Method 1

which blocks lithium diffusion and maintains stoichiometry

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Implementation Method 2

the formation of the piezoelectric layer is done by epitaxy, on said first electrode, of a material of the ABO3 type

Methodology Applied
Scientific EffectEpitaxy: Epitaxy

Data Source

PatentUS20230216474A1Bulk acoustic wave device and method of making such a device
Publication Date: 2023.07.06 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • US20230216474A1 patent drawing
  • US20230216474A1 patent drawing
  • US20230216474A1 patent drawing

AI summary

An electroacoustic device includes, stacked in a direction a silicon-based substrate, a first electrode, a piezoelectric layer with the basis of a perovskite taken from among lithium niobate LiNbO3, lithium tantalum LiTaO3, or an Li(Nb,Ta)O3 alloy, on the first electrode, a second electrode disposed on the piezoelectric layer. Advantageously, the first electrode is made of a nitride-based electrically conductive refractory material, such as TiN, VN, TaN. The invention also relates to a method for producing such a device.