RF Module Grounded Shield Layout for Noise Isolation
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Solution Overview
Problem
Existing radio frequency modules face challenges in ensuring adequate isolation among electronic components, which can lead to noise interference and characteristic deterioration.
Innovation Solution
A radio frequency module design that includes a mounting substrate with a metal member and multiple metal layers, where the metal member is in contact with both the first and second metal layers, enhancing noise suppression and improving isolation between electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shield wall is provided among electronic components, then isolation between components is improved, but the isolation is still insufficient to prevent noise interference
Solution Approach 1:
The shielding structure is divided into multiple segments: a shield wall on the first main surface, a first metal layer in the resin layer, and a second metal layer on the outer surface. Each segment contributes to the overall shielding effect, creating multiple barriers against noise interference rather than relying on a single shield wall.
Solution Approach 2:
The shielding approach transitions from a two-dimensional planar shield wall to a three-dimensional multi-layer structure extending through the resin layer thickness. The first metal layer is embedded within the resin layer at a different depth plane, creating vertical dimensionality that enhances isolation in addition to the horizontal shielding provided by the shield wall and second metal layer.
2Reliability
If multiple metal layers are added to enhance noise suppression, then isolation is improved, but device complexity increases
Solution Approach 1:
The resin layer serves multiple functions: it provides mechanical support and bonding for the electronic components and metal layers, provides electrical insulation, and houses the first metal layer for electromagnetic shielding. This multi-functionality reduces the need for additional separate structures, thereby limiting complexity increase despite the enhanced shielding capability.
Solution Approach 2:
The first metal layer is integrated within the resin layer rather than being a separate external component. The shield wall, first metal layer, and second metal layer are combined into a unified shielding system where each element complements the others, creating effective noise suppression through their collective action rather than requiring each layer to independently handle all shielding requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced contact configuration between the metal member and metal layers improves noise suppression, thereby reducing interference and maintaining the performance of electronic components.
Implementation Method 1
The first metal layer has a ground potential and is in contact with the second metal layer... The second metal layer covers at least a part of the resin layer... the metal member is in contact with the first metal layer and the second metal layer
Data Source
AI summary
To improve isolation among a plurality of electronic components. A radio frequency module includes a mounting substrate, a first electronic component and a second electronic component, a metal member, a first metal layer, a resin layer, and a second metal layer. The metal member is disposed between the first electronic component and the second electronic component on a first main surface of the mounting substrate. The first metal layer is disposed on the first main surface of the mounting substrate. The second metal layer covers at least a part of the resin layer. The first metal layer has a ground potential, and is in contact with the second metal layer. The metal member is in contact with the first metal layer and the second metal layer.