Quartz Piezoelectric Element Patterning With Single-Side Exposure
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Solution Overview
Problem
The manufacturing cost of piezoelectric vibration elements, such as quartz oscillators, increases with the number of exposure and development processes required, making it challenging to maintain precision while reducing costs.
Innovation Solution
A manufacturing method that involves forming metal layers on both surfaces of a quartz wafer, performing exposure and development processes only on one side to create a patterned photoresist layer, which is then used to define the size and shape of the piezoelectric vibration element, reducing the need for multiple exposure processes and lowering costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple exposure and development processes are performed on both sides of the quartz wafer to achieve precise patterning, then the manufacturing precision is improved, but the manufacturing cost increases due to additional manpower, masks, and machines
Solution Approach 1:
The patent divides the photoresist material layers into two separate groups: a first group on the first surface and a second group on the second surface. Only the first group undergoes exposure and development processes to form a patterned layer, while the second group remains unprocessed. This segmentation allows precise patterning to be achieved on one side without incurring the costs of processing both sides, thereby resolving the contradiction between manufacturing precision and manufacturing cost.
2Manufacturing precision
If multiple exposure and development processes are performed to meet precise requirements of quartz oscillators, then the manufacturing precision is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the unnecessary exposure and development processes from the second group of photoresist material layers on the second surface. By removing these redundant steps while retaining the first group's processing for precise patterning, the invention reduces overall process complexity while maintaining the precision required for quartz oscillators.
3Manufacturing precision
If exposure and development processes are performed on both sides of the quartz wafer, then the patterning completeness is improved, but the manufacturing time increases
Solution Approach 1:
The patent applies partial action by performing exposure and development processes only on the first group of photoresist material layers on the first surface, rather than processing both groups on both surfaces. This partial processing approach achieves sufficient patterning completeness for the quartz oscillator while significantly reducing the total manufacturing time required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the process, reduces manufacturing costs, and maintains the precise requirements of the piezoelectric vibration element by using a single exposure and development process on one side of the quartz wafer, allowing for precise definition of the element's size and shape.
Implementation Method 1
Only the first photoresist material layer is performed to an exposure and development process to form a first patterned photoresist layer
Data Source
AI summary
A manufacturing method of a piezoelectric vibration element includes at least the following steps. Quartz wafer is provided. A first metal material layer and a second metal material layer are fully formed on a first surface and a second surface of the quartz wafer, respectively. A first photoresist material layer and a second photoresist material layer are fully formed on the first metal material layer and the second metal material layer, respectively. Only the first photoresist material layer is performed to an exposure and development process to form a first patterned photoresist layer. A portion of the first metal material layer is removed by the first patterned photoresist layer to form a metal pattern. The first patterned photoresist layer and the second photoresist material layer are removed.