Integrated MEMS Resonator Packaging for Compact Reference Clocks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional resonators in electronic devices are large and expensive, occupying valuable space in miniaturized devices and requiring separate packaging, which complicates manufacturing and increases parasitic effects due to long routing distances from processors.
Innovation Solution
Incorporating a microelectromechanical systems (MEMS) resonator die within a glass or quartz substrate, which serves as a package, reducing size and eliminating the need for separate wafer-level packaging, and using thin film piezoelectric on substrate (TPoS) resonators with vias and cavities to provide a high-Q reference clock signal and temperature compensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resonators are used in electronic devices, then timing function is provided, but device size increases and manufacturing complexity increases
Solution Approach 1:
The patent combines the resonator die with the processor die into a single integrated device, eliminating the need for separate resonator packaging and reducing overall device volume. The resonator and processor are fabricated together on the same semiconductor substrate, sharing common structures such as the substrate and packaging, thereby reducing size while maintaining timing functionality.
Solution Approach 2:
The resonator structure is nested within the processor die structure, with the resonator die positioned adjacent to or within the same packaging as the processor. This nesting approach allows the resonator to be housed within the same physical envelope as the processor, significantly reducing the overall device footprint compared to separate mounting.
2Reliability
If conventional resonators are used in electronic devices, then timing function is provided, but manufacturing complexity increases due to separate packaging
Solution Approach 1:
The patent merges the resonator packaging with the processor packaging into a single unified structure. Both components share the same substrate, interconnect structure, and external packaging, eliminating the need for separate resonator packaging steps and reducing manufacturing complexity while maintaining the resonator's timing function.
Solution Approach 2:
The semiconductor substrate and packaging structure serve multiple functions simultaneously: they support both the processor and resonator, provide interconnection for both components, and offer environmental protection for both devices. This multi-functionality reduces the number of separate packaging operations required.
3Reliability
If conventional resonators are used with long routing distances, then timing signal is transmitted, but parasitic effects increase
Solution Approach 1:
By integrating the resonator and processor on the same die or substrate, the patent dramatically reduces the routing distance between the resonator output and the processor input. This short interconnect minimizes parasitic inductance, capacitance, and resistance, thereby reducing harmful parasitic effects while maintaining reliable timing signal transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall device size, simplifies manufacturing, minimizes parasitic effects, and enables the creation of a GHz range reference clock with improved accuracy and reduced complexity.
Implementation Method 1
a piezoelectric layer over the first electrode layer
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An electronic device and associated methods are disclosed. In one example, the electronic device includes a MEMS die (130) located within a substrate (120), and below a processor die (110, 112). In selected examples, the MEMS die includes a resonator. Example methods of forming MEMS resonator devices are also shown.