Multilayer Strip-Line RF Filter Module for Wider Passband

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Solution Overview

Problem

Existing radio frequency (RF) filter modules have limited passband bandwidth, necessitating the use of additional components like peripheral coils that occupy space and are difficult to integrate, limiting the ability to achieve wider passbands without material changes.

Innovation Solution

Incorporating a strip line configured to generate inductance between the filter and ground, disposed on multiple layers with pulse-shaped portions, to increase the difference between resonance and anti-resonance frequencies, thereby enhancing the passband without increasing the module's size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If additional components like peripheral coils are used to widen passband, then passband bandwidth is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvepassband bandwidthVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The invention extracts the inductance function from external peripheral coil components and integrates it directly into the filter module structure through strip lines formed on the packaging substrate. This eliminates the need for separate peripheral coil components while achieving the same electrical effect of widening the passband.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the inductance-generating function with the existing filter and packaging substrate structure. Strip lines are formed on the substrate to provide inductance, combining what were previously separate functions (filtering and inductance) into a single integrated module, thereby simplifying device complexity while maintaining passband performance.

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If peripheral coils are added to increase passband, then bandwidth is improved, but ease of manufacture deteriorates

Engineering Contradiction:
Improvepassband bandwidthVSAvoidease of manufacture
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The inductance-generating strip lines are formed on the packaging substrate using standard PCB fabrication techniques, merging the inductance function with the existing substrate manufacturing process. This integration allows the entire filter module to be manufactured as a single unit using conventional techniques, significantly improving ease of manufacture compared to assembling separate peripheral coil components.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If module size is increased to accommodate additional components, then passband bandwidth is improved, but volume of stationary object increases

Engineering Contradiction:
Improvepassband bandwidthVSAvoidmodule volume
Core Design Contradiction:
Adaptability or versatilityVSVolume of stationary object

Solution Approach 1:

The invention removes the need for external peripheral coil components that would increase module volume. By extracting the inductance function and implementing it through integrated strip lines on the packaging substrate, the passband is widened without increasing the overall module size.

Inventive Principle:
Principle #2Taking out (Extraction)

4Adaptability or versatility

If strip line is disposed on multiple layers, then passband is widened, but device complexity increases

Engineering Contradiction:
Improvepassband bandwidthVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The invention utilizes the vertical dimension by disposing strip lines on multiple layers of the packaging substrate. This multi-layer configuration creates additional inductive pathways that widen the passband. While this adds some complexity, it leverages the existing multi-layer substrate structure and standard PCB routing techniques, making the implementation feasible and manageable.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves a wider passband of 3% without increasing the chip size, utilizing the available space efficiently and maintaining the module's dimensions.

Implementation Method 1

a strip line configured to generate inductance between the filter and ground

Methodology Applied
Scientific EffectInductance: Inductor

Data Source

PatentUS20250247080A1Filter module with widened passband
Publication Date: 2025.07.31 SKYWORKS SOLUTIONS INC
  • US20250247080A1 patent drawing
  • US20250247080A1 patent drawing
  • US20250247080A1 patent drawing

AI summary

Filter modules having a wider passband are provided herein. In certain embodiments, the filter module comprises an input node; an output node; a filter disposed along a signal path extending from the input node to the output node; a strip line configured to generate an inductance between the filter and a ground such to increase a bandwidth of a passband of the filter module, the single strip line disposed on multiple layers, each of the multiple layers defined by a plurality of pulse-shaped) portions of the strip line disposed on a plane.