Acoustic Wave Element Pickup Using a Hollow Support to Prevent Cracks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing acoustic wave elements often result in the occurrence of cracks, particularly due to the mechanical stress during the separation process from dicing tapes, which can hinder the effective lamination and operation of these devices.
Innovation Solution
The method involves preparing a wafer with a support having a hollow portion that overlaps the functional electrode, using a dicing tape to separate the acoustic wave element, and employing an abutting pin to pick up the element while ensuring the pin contacts the hollow portion, thereby reducing mechanical stress on the piezoelectric material layer and preventing cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a pin is used to separate the acoustic wave element from the dicing tape, then the element can be picked up and transferred, but mechanical stress may cause cracks in the piezoelectric material layer
Solution Approach 1:
The hollow portion of the support acts as an intermediary structure between the pin and the piezoelectric material layer. When the pin abuts against the hollow portion, the force is distributed through the support structure rather than being concentrated on the fragile piezoelectric layer, thus enabling element pickup without causing cracks
Solution Approach 2:
The support is designed with a hollow portion that segments the force application area. This segmentation allows the pin to contact only the support structure at the hollow portion location, isolating the piezoelectric material layer from direct mechanical stress during the pickup process
2Manufacturing precision
If the pin contacts the piezoelectric material layer directly, then precise positioning is achieved, but cracks occur due to concentrated mechanical stress
Solution Approach 1:
The hollow portion serves as a mediator that enables precise positioning through the pin-abutting mechanism while protecting the piezoelectric material layer. The pin contacts the hollow portion at a specific location, providing positioning accuracy without transmitting damaging stress to the piezoelectric layer
Solution Approach 2:
The hollow portion is strategically located to create a local contact zone that is optimal for pin abutting. This local structural modification concentrates the positioning function at the hollow portion while leaving the piezoelectric material layer intact and free from stress
Data Source
AI summary
A method for manufacturing an acoustic wave element includes preparing a wafer, attaching the wafer to a dicing tape, dicing the wafer to singulate the acoustic wave element, and abutting a pin against the acoustic wave element with the dicing tape interposed therebetween to separate the acoustic wave element from the dicing tape, and pick up the acoustic wave element. A position at which the pin is abutted against the acoustic wave element overlaps a hollow portion in a support of the acoustic wave element in a lamination direction.