RF Module Filter Layout for Simultaneous Transmission Heat Isolation
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Solution Overview
Problem
Heat generated by one filter in a radio-frequency power-amplifying module affects the characteristics of another filter during simultaneous transmission, leading to deterioration.
Innovation Solution
A radio-frequency module design that includes a mounting substrate, first and second filters, a resin layer, and a shield layer, with conductors extending to shield layers to mitigate heat transfer between filters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If both first filter and second filter are used for simultaneous transmission, then transmission capability is improved, but heat from first filter causes deterioration of second filter characteristics
Solution Approach 1:
The patent introduces a heat dissipation structure that segments the thermal management system into filter-specific zones. Each filter has its own heat dissipation path through the mounting substrate, preventing heat from one filter from affecting another filter during simultaneous transmission operations.
Solution Approach 2:
The mounting substrate acts as an intermediary thermal management component between the filters and the environment. It provides dedicated heat dissipation paths that mediate heat transfer, allowing each filter to dissipate heat independently without direct thermal coupling that would cause cross-interference.
2Area of stationary object
If filters are placed close together on mounting substrate, then device area is reduced, but heat transfer between filters increases causing characteristic deterioration
Solution Approach 1:
The patent implements local quality differentiation in the mounting substrate by creating heat dissipation structures with different thermal conductivities in different regions. Areas near each filter have optimized thermal properties to facilitate localized heat dissipation, while maintaining compact overall device area.
Solution Approach 2:
The patent addresses heat transfer issues by transitioning from a two-dimensional planar arrangement to a three-dimensional thermal management structure. Heat dissipation paths extend vertically through the mounting substrate, providing additional dimensional space for thermal management without increasing the device's footprint area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the possibility of heat-induced deterioration of filter characteristics during simultaneous transmission, ensuring effective operation of both filters.
Implementation Method 1
The conductor is disposed on the first main surface of the substrate and is in contact with the first filter and the substrate
Implementation Method 2
The shield layer is disposed on an outer surface of the resin layer
Data Source
AI summary
A radio-frequency module includes a mounting substrate, a first filter, a second filter, a shield layer, and a conductor. The mounting substrate has a first main surface and a second main surface on opposite sides. The shield layer is disposed on an outer surface of a resin layer with which the first filter and the second filter are covered. The radio-frequency module is capable of performing simultaneous transmission by using both the first filter and the second filter. The conductor is disposed on the first main surface of the mounting substrate and is in contact with the transmitting filter and the mounting substrate. The conductor is in contact with the shield layer on a side other than a side closer to the second filter than to the first filter.