Oscillator Master Board Layout to Prevent Thin Quartz Cracking
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Solution Overview
Problem
The thinning of quartz substrates in high-frequency oscillators leads to cracking issues, adversely affecting production yields.
Innovation Solution
A method involving the formation of an oscillator master board with a frame and connecting portions, where oscillators are connected to connecting frames through thin connecting portions, allowing for precise etching and separation to maintain substrate integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the quartz substrate is thinned to achieve high-frequency oscillation band, then the oscillation frequency is improved, but the substrate becomes prone to cracking
Solution Approach 1:
The patent divides the substrate into multiple segments by introducing connecting portions between adjacent oscillators. These connecting portions act as stress isolation zones that segment the continuous substrate into discrete units, preventing crack propagation across the entire substrate while maintaining the thinned structure necessary for high-frequency operation
Solution Approach 2:
The connecting portions serve as intermediary elements between adjacent oscillators. These intermediaries provide mechanical support and stress distribution at critical interfaces, mediating the stress concentration that would otherwise cause cracking in the thinned substrate regions between oscillators
2Speed
If the quartz substrate is thinned to achieve high-frequency oscillation band, then the oscillation frequency is improved, but the production yield deteriorates
Solution Approach 1:
The connecting portions are pre-formed during the substrate processing stage before final oscillator separation. This preliminary action of creating stress-isolation structures early in the manufacturing process prevents cracking during subsequent handling and separation operations, thereby improving production yield without compromising the thinned substrate design
Solution Approach 2:
The connecting portions provide beforehand cushioning by distributing mechanical stresses across multiple locations during the manufacturing and separation processes. This stress distribution cushioning effect protects the thinned substrate from cracking during handling, bonding, and separation operations, thereby maintaining high production yields
3Productivity
If multiple oscillators are arranged on the same substrate, then the productivity is improved, but the stress concentration increases
Solution Approach 1:
By introducing connecting portions between adjacent oscillators, the patent segments the substrate structure into discrete oscillator units. This segmentation creates stress isolation zones that prevent stress concentration from affecting the entire substrate, enabling multiple oscillators to be arranged on the same substrate without cumulative stress problems
Solution Approach 2:
The connecting portions introduce local quality changes at specific interfaces between oscillators. These localized structural modifications provide stress relief zones precisely where stress concentration would occur between adjacent thinned oscillator regions, allowing high-density oscillator arrangements while maintaining substrate integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances production yields by minimizing damage to oscillators during separation, ensuring consistent high-frequency performance.
Implementation Method 1
Resonators, such as quartz oscillators, are components that utilize piezoelectric effect of quartz crystals to generate oscillation frequencies
Data Source
AI summary
An oscillator master board includes a frame, oscillators and connecting portions. The frame includes an outer frame and connecting frames that are disposed within the outer frame and that are connected to the outer frame. The connecting frames extend along a first direction and are spaced apart from each other along a second direction that intersects the first direction. The oscillators are spaced apart from each other. Each of the oscillators is disposed adjacent to a corresponding one of the connecting frames and includes an oscillator substrate, a top frame, a top electrode unit and a back electrode unit. The connecting portions are disposed to connect the oscillators to the connecting frames. Each of the oscillators is connected to the corresponding one of the connecting frames through at least a corresponding one of the connecting portions. A method for making the oscillator master board is also provided.