RF Module Ground Shield Structure for Compact Signal Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electromagnetic coupling between circuit components in radio-frequency modules leads to signal deterioration and increased module size, hindering miniaturization in multiband mobile communication devices.
Innovation Solution
A radio-frequency module design incorporating a metal plate set to ground potential, with a body part perpendicular to the substrate and joint parts connected to circuit components via bonding wires, reducing electromagnetic coupling and allowing for miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If circuit components are disposed on the surface of the module substrate, then the module can be manufactured with conventional techniques, but the area required for laying out electrodes increases, making miniaturization difficult
Solution Approach 1:
The invention transitions from two-dimensional surface mounting to three-dimensional vertical arrangement by disposing circuit components on the side surface of the module substrate. The substrate stands on its end face with the major face vertical, allowing components to be arranged along the height of the substrate rather than spreading across its surface area, thereby achieving miniaturization while maintaining conventional manufacturing techniques.
2Area of stationary object
If circuit components are disposed close together to reduce module size, then miniaturization is achieved, but electromagnetic coupling occurs between components, deteriorating signal quality
Solution Approach 1:
The invention introduces a ground electrode as an intermediary element disposed between circuit components that are adjacent to each other on the side surface of the substrate. This ground electrode acts as a shield to prevent electromagnetic coupling between neighboring components, allowing them to be positioned close together for miniaturization while maintaining signal quality through electromagnetic isolation.
3Ease of manufacture
If conventional surface mounting is used, then manufacturing is simple, but the module size increases, preventing miniaturization in multiband devices
Solution Approach 1:
The invention changes the mounting dimension from horizontal surface placement to vertical side-surface arrangement. By standing the substrate on its end face and disposing components on the vertical side surface, the layout utilizes the third dimension (height) rather than spreading in the horizontal plane, thereby reducing the footprint area and enabling miniaturization while maintaining compatibility with conventional manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design minimizes signal interference and maintains signal quality while enabling compact module size, addressing electromagnetic coupling issues and facilitating miniaturization.
Implementation Method 1
a metal plate disposed over the major face and set to a ground potential. The metal plate includes a body part extending in a direction perpendicular to the major face
Data Source
AI summary
A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; and a metal shield plate disposed over the major face and set to a ground potential. The metal shield plate includes a shield part extending in a direction perpendicular to the major face, and a joint part parallel to the major face and spaced apart from the major face, the joint part extending from the shield part. A top face of at least one of the first circuit component and the second circuit component is connected with the joint part by a bonding wire. With the module substrate seen in plan view, the metal shield plate is disposed between the first circuit component and the second circuit component.