Compartmentalized Module Shielding for EMI Isolation
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Solution Overview
Problem
Existing shielded electronic modules face challenges in reducing electromagnetic interference (EMI) with the external environment and isolating radiative components within the module, while maintaining cost-effectiveness and avoiding increased size and complexity.
Innovation Solution
A shielded electronic module design featuring a module shielding structure that directly and continuously covers the top and side surfaces of the module, incorporating submodule side and top shielding structures made of materials like stainless steel, copper, aluminum, silver, and gold, with a module mold compound encapsulating these structures to individually shield electronic submodules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a grounded enclosure shield is used to block electromagnetic emissions, then EMI reduction is achieved, but the device size and structural complexity increase
Solution Approach 1:
The patent divides the shielding structure into multiple discrete submodule shielding structures, each covering individual electronic submodules. Instead of using a single large grounded enclosure, the shield is segmented into smaller units that can be independently positioned and connected through conductive members, thereby reducing overall structural complexity while maintaining EMI protection.
Solution Approach 2:
The patent implements nested shielding by placing submodule shielding structures within the overall module housing, with each submodule shield containing and protecting individual electronic components. This nested arrangement allows multiple levels of shielding protection without requiring a single large complex enclosure, effectively reducing EMI while managing structural complexity.
2Object-affected harmful factors
If individual submodule shielding is implemented, then radiative component isolation is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the shielding system into standardized submodule shielding units that can be manufactured independently and then assembled. Each submodule shield is designed as a discrete component with standardized connection interfaces, allowing for simplified manufacturing processes and easier assembly compared to custom-built individual shields for each component.
Solution Approach 2:
The patent employs universal conductive members that serve multiple functions: they electrically connect adjacent submodule shielding structures, provide mechanical support, and facilitate thermal management. This multi-functionality reduces the number of separate components needed, thereby simplifying manufacturing while achieving effective radiative component isolation.
3Object-affected harmful factors
If conductive members are used to electrically connect submodule shielding structures, then EMI shielding effectiveness is improved, but thermal management challenges increase
Solution Approach 1:
The patent designs conductive members to simultaneously provide electrical connectivity for EMI shielding and thermal pathways for heat dissipation. By using the same conductive structures for both electromagnetic shielding and thermal management, the patent avoids adding separate thermal management components, thereby maintaining EMI effectiveness while addressing thermal challenges through multi-functional design.
Solution Approach 2:
The patent employs composite material structures for the conductive members and shielding components that optimize both electrical conductivity for EMI protection and thermal conductivity for heat dissipation. These composite materials enable simultaneous achievement of effective EMI shielding and thermal management without requiring separate systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces EMI with the external environment and isolates radiative components within the module, enhancing performance and maintaining thermal conductivity without increasing the module's size or complexity.
Implementation Method 1
When electromagnetic emissions from electronic components within the shield strike the interior surface of the shield, the electromagnetic emissions are electrically shorted through the grounded conductive material, thereby reducing emissions.
Implementation Method 2
The module shielding structure directly and continuously covers the top surface and the side surface of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the first electronic submodule.
Data Source
AI summary
The disclosure relates to a shielded electronic module which includes a module shielding structure and an electronic module with an interposer, a shielded electronic submodule over the interposer, and a module mold compound over the interposer and encapsulating sides of the shielded electronic submodule. Herein, the shielded electronic submodule includes an electronic submodule and a submodule side shielding structure, which covers sides of the electronic submodule to provide the sides of the shielded electronic submodule. A top surface of the electronic module is a combination of a top surface of the module mold compound and a top surface of the shielded electronic submodule, which is not covered by the module mold compound. The module shielding structure directly and continuously covers the top surface and sides of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the electronic submodule.