Heated Resonator Layout for Accurate Quartz Temperature Control
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Solution Overview
Problem
In existing quartz crystal resonators, the heat from the heater circuit is not efficiently transferred to the quartz crystal element, making prompt and accurate temperature control difficult.
Innovation Solution
The resonator device is designed with a substrate and lid configuration that allows the first bond part of the resonator element to overlap the heater in a plan view, enabling efficient heat transfer and high-accuracy temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the heater circuit and quartz crystal element are placed at a distance from each other, then the device structure is simplified and easier to manufacture, but the heat transfer efficiency deteriorates and temperature control accuracy worsens
Solution Approach 1:
The patent transitions from a planar arrangement where the heater and crystal are separated on the same surface to a three-dimensional arrangement where the bond part extends vertically to overlap the heater. This dimensional change enables the bond part to serve dual functions: mechanical bonding and thermal conduction, resolving the contradiction between ease of manufacture and temperature control accuracy.
Solution Approach 2:
The bond part acts as an intermediary component between the substrate and the resonator element. By extending the bond part to overlap the heater, it serves as a thermal conduit that efficiently transfers heat from the heater to the resonator element, while still performing its primary mechanical bonding function.
2Adaptability or versatility
If the heater circuit is placed far from the quartz crystal element, then the layout flexibility is improved, but the heat transfer efficiency deteriorates and response time increases
Solution Approach 1:
The bond part is designed to extend in the vertical dimension to overlap the heater, creating a direct thermal pathway without requiring the heater to be positioned immediately adjacent to the crystal on the planar surface. This maintains layout flexibility while dramatically improving heat transfer speed.
3Measurement precision
If the bond part is extended to overlap the heater, then the temperature control accuracy is improved, but the device complexity increases
Solution Approach 1:
The bond part is designed to perform multiple functions simultaneously: mechanical bonding between the substrate and resonator element, and thermal conduction from the heater to the resonator element. This multi-functionality improves temperature control accuracy without adding separate components, thereby avoiding increased device complexity.
Solution Approach 2:
The patent merges the bonding function and heating function by making the bond part extend to overlap the heater. This consolidation eliminates the need for separate bonding and heating structures, improving temperature control while maintaining simple device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances oscillation frequency accuracy and stability by ensuring efficient heat transfer to the resonator element, allowing for precise temperature control and improved performance.
Implementation Method 1
the first bond part is arranged to overlap the heater in a plan view from a direction perpendicular to the first surface... enabling efficient heat transfer
Implementation Method 2
a temperature sensor disposed at the first surface of the substrate... provided with a temperature control circuit configured to control the heater based on an output of the temperature sensor
Implementation Method 3
a vibrating element which is arranged at the first surface of the substrate, and has a first bond part bonded to the substrate
Data Source
AI summary
A resonator device includes a substrate, a heater provided to the substrate, a temperature sensor provided to the substrate, a resonator element having a bond part bonded to the substrate, and a lid bonded to the substrate so as to house the resonator element in cooperation with the substrate, and the bond part is arranged to overlap the heater in a plan view.