Multilayer SAW Package Structure for Heat Dissipation and Ruggedness

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Solution Overview

Problem

Existing packaged surface acoustic wave devices are bulky and lack efficient heat dissipation and mechanical ruggedness, limiting their application in smaller and thinner radio frequency electronic systems.

Innovation Solution

A packaged surface acoustic wave device with a conductive pillar and roof structure that supports the roof structure without electrical communication, combined with a multilayer piezoelectric substrate and conductive vias for improved heat dissipation and mechanical support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a traditional packaged surface acoustic wave device is designed with protective packaging, then the device is protected from environmental damage, but the package increases the overall size and thickness of the device

Engineering Contradiction:

Improvedevice protectionVSAvoiddevice size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent merges the protective packaging function with the electrical connection function by integrating the conductive pillar into the package structure. The conductive pillar serves dual purposes: providing mechanical support for the roof structure and establishing electrical pathways between the interdigital transducer electrode and the conductive via in the support substrate, thereby eliminating the need for separate protective packaging that would increase device size.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conductive pillar is designed as a multi-functional component that simultaneously provides mechanical support for the roof structure and establishes electrical connections. This universal component performs both structural and electrical functions, reducing the overall device size while maintaining protection and connectivity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Volume of moving object

If the package structure is simplified to reduce size, then the device becomes smaller and thinner, but the mechanical ruggedness and heat dissipation capability are compromised

Engineering Contradiction:

Improvedevice sizeVSAvoidmechanical ruggedness

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent employs a composite package structure consisting of a support substrate, piezoelectric layer, interdigital transducer electrode, roof structure, and conductive pillar. This composite structure provides enhanced mechanical ruggedness and heat dissipation capability while maintaining a compact size, as each material is selected and arranged to optimize both structural strength and thermal management.

Inventive Principle:

Principle #40Composite materials

3Reliability

If electrical connection pathways are extended through the package, then signal transmission is achieved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improvesignal transmissionVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The conductive pillar acts as an intermediary component that provides both electrical connection and thermal management. It establishes the electrical pathway between the interdigital transducer electrode and the conductive via while simultaneously serving as a heat dissipation pathway, conducting heat away from the active device regions to the support substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat dissipation and mechanical ruggedness, enabling smaller and thinner devices suitable for radio frequency modules and wireless communication systems.

Implementation Method 1

The second conductive pillar can be configured to dissipate heat generated by the interdigital transducer electrode

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a piezoelectric layer over the support substrate, an interdigital transducer electrode over the piezoelectric layer

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS12470201B2Packaged multilayer piezoelectric surface acoustic wave device with conductive pillar

Publication Date: 2025.11.11 SKYWORKS SOLUTIONS INC

AI summary

A packaged surface acoustic wave device is disclosed. the packaged surface acoustic wave device can include a support substrate that includes a conductive via formed therein, a piezoelectric layer over the support substrate, an interdigital transducer electrode over the piezoelectric layer, a roof structure over the interdigital transducer electrode, and a conductive pillar directly over the conductive via. The conductive pillar supports the roof structure and defines at least a portion of a signal pathway between the interdigital transducer electrode and the conductive via.