IC Package In-Plane Inductors With Single-Material Encapsulation
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Solution Overview
Problem
The integration of magnetic materials within IC package substrates poses process and architectural challenges, particularly for coreless packages where fully encapsulating traces with magnetic material requires multiple de-paneling operations and may necessitate different magnetic compositions.
Innovation Solution
The method involves forming metallization layers and apertures within the package substrate, applying magnetic material to encapsulate the inductor structure without de-paneling, and capping it with dielectric layers, allowing for full encapsulation using a single magnetic material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple de-paneling operations are performed to access backside for supplemental magnetic material application, then full encapsulation of traces is achieved, but process complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies preliminary action by forming openings in the substrate before applying the magnetic material layer. This allows the magnetic material to be applied in a single operation without requiring subsequent de-paneling steps, as the openings are pre-positioned to accommodate the magnetic material placement strategy
Solution Approach 2:
The patent segments the substrate by forming openings that divide it into front and back regions. This segmentation allows selective application of magnetic material to specific areas (frontside or backside) while maintaining the ability to achieve full encapsulation without requiring multiple de-paneling operations
2Manufacturing precision
If supplemental magnetic material is applied over backside traces, then full encapsulation is achieved, but multiple magnetic compositions are required
Solution Approach 1:
The patent applies universality by using a single magnetic material layer that serves multiple functions: it can be applied to frontside openings, backside openings, or both, depending on the inductor design requirements. This eliminates the need for different magnetic compositions while achieving full encapsulation
Solution Approach 2:
The substrate openings act as intermediaries that enable the magnetic material to reach and encapsulate traces on both front and back sides. The openings provide access pathways for the magnetic material application process, allowing a single material layer to fulfill multiple encapsulation needs
3Manufacturing precision
If de-paneling operations are performed to access backside, then supplemental magnetic material can be applied, but process time and production efficiency decrease
Solution Approach 1:
The patent applies preliminary action by forming all necessary openings in the substrate before magnetic material application. This upfront preparation eliminates the need for time-consuming de-paneling operations during or after the magnetic material application process, thereby improving production efficiency
Solution Approach 2:
The patent merges the magnetic material application process for frontside and backside inductors into a single operation. By having all openings pre-formed and applying magnetic material in one step, the process combines multiple tasks that would otherwise require separate de-paneling and application steps
Data Source
AI summary
An integrated circuit (IC) package substrate, comprising a magnetic material embedded within a dielectric material. A first surface of the dielectric material is below the magnetic material, and a second surface of the dielectric material, opposite the first surface, is over the magnetic material. A metallization level comprising a first metal feature is embedded within the magnetic material. A second metal feature is at an interface of the magnetic material and the dielectric material. The second metal feature has a first sidewall in contact with the dielectric material and a second sidewall in contact with the magnetic material.