Acoustic Wave Filter Shield Structure for Printable RF Modules
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Solution Overview
Problem
Existing high frequency modules do not easily allow for printing on the module surface, which can lead to degradation of the acoustic wave filter during printing processes.
Innovation Solution
A high frequency module design that includes a mounting substrate, an acoustic wave filter, a protection member, a resin layer, and a shield layer, where the protection member is in contact with both the acoustic wave filter and the shield layer, allowing for easy printing on the module surface while protecting the acoustic wave filter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If printing is performed directly on the module surface, then printing can be completed, but the acoustic wave filter degrades during the printing process
Solution Approach 1:
The patent introduces a shield electrode layer as an intermediary component between the printing surface and the acoustic wave filter. This shield layer absorbs or blocks the harmful effects of the printing process (such as heat, mechanical stress, or chemical exposure), allowing printing to be performed on the module surface without degrading the acoustic wave filter underneath.
Solution Approach 2:
The shield electrode layer is pre-formed on the module surface before the printing process occurs. This preliminary protective layer is specifically designed to withstand the printing conditions while protecting the underlying acoustic wave filter, enabling the printing operation to proceed without causing damage.
2Ease of manufacture
If the acoustic wave filter is exposed on the module surface, then the filter can be accessed, but printing on the module surface becomes difficult or impossible
Solution Approach 1:
The shield electrode layer serves as a mediating surface that allows printing operations to be performed without requiring direct exposure of the acoustic wave filter. The shield layer provides a suitable substrate for printing while the acoustic wave filter remains protected underneath, resolving the conflict between printing capability and filter accessibility.
3Temperature
If no protective layer is added, then the structure remains simple, but heat dissipation from the acoustic wave filter is insufficient
Solution Approach 1:
The shield electrode layer is designed to perform multiple functions simultaneously: it provides electrical shielding, serves as a printable surface, and acts as a heat dissipation pathway. By making this single component multi-functional, the patent improves heat dissipation without significantly increasing overall structural complexity.
Solution Approach 2:
The patent combines the shielding function and heat dissipation function into a single integrated shield electrode layer. This merging of functions allows the structure to handle both electromagnetic interference and thermal management needs without adding separate protective components, thereby improving heat dissipation while maintaining relatively simple structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables easy printing on the module surface without degrading the acoustic wave filter, and improves heat dissipation characteristics by transferring heat from the acoustic wave filter to the shield layer through the protection member.
Implementation Method 1
improves heat dissipation characteristics by transferring heat from the acoustic wave filter to the shield layer through the protection member
Implementation Method 2
The acoustic wave filter includes a piezoelectric substrate
Data Source
AI summary
A high frequency module includes a mounting substrate, an acoustic wave filter, a protection member, a resin layer, and a shield layer. The acoustic wave filter is mounted on a first main surface of the mounting substrate. The protection member is disposed on a main surface of the acoustic wave filter that is far from the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate and covers an outer peripheral surface of the acoustic wave filter and an outer peripheral surface of the protection member. The shield layer covers the resin layer and the protection member. The protection member is in contact with both the acoustic wave filter and the shield layer. The acoustic wave filter includes a piezoelectric substrate. A main surface of the piezoelectric substrate that is far from the mounting substrate is in contact with the protection member.