Acoustic Resonator Through-Hole Layout for Faster Etch Drying
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Solution Overview
Problem
The issue of sticking and slow drying of etching liquids in space portions of acoustic wave devices, particularly in large and small space portions, leading to inefficiencies in manufacturing.
Innovation Solution
The design includes a support substrate with a piezoelectric layer having different space portions and through-holes of varying sizes, allowing for efficient etching and reducing sticking by optimizing the area and size of these spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uniform through-holes are used for all space portions, then manufacturing process is simple, but large space portions experience sticking and slow drying
Solution Approach 1:
The patent applies local quality by varying the through-hole sizes according to the specific requirements of different space portions. Large space portions are equipped with larger through-holes to facilitate faster drying, while small space portions use smaller through-holes to prevent sticking. This localized optimization resolves the contradiction between manufacturing simplicity and drying reliability.
2Speed
If through-hole size is increased for large space portions, then drying speed improves, but manufacturing precision decreases
Solution Approach 1:
The patent employs parameter changes by systematically varying the through-hole diameter parameter based on the space portion size. Each through-hole's diameter is optimized to achieve appropriate drying speed while remaining within manufacturable tolerances. This parameter optimization resolves the contradiction between drying speed and manufacturing precision.
3Reliability
If multiple through-hole sizes are implemented, then drying performance is optimized, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the through-hole population into distinct size categories corresponding to different space portion types. This segmentation allows for optimized drying performance in each category while maintaining a manageable level of complexity through standardized size groups rather than continuous variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves reduced sticking and faster drying times, enhancing manufacturing efficiency and maintaining resonance characteristics in acoustic wave devices.
Implementation Method 1
a piezoelectric layer on the support in the first direction
Data Source
AI summary
An acoustic wave device includes a support including a support substrate with a thickness in a first direction, a piezoelectric layer on the support in the first direction, and resonators each including a functional electrode on the piezoelectric layer in the first direction. The support includes first and second space portions at positions where the respective resonators at least partially overlap in plan view in the first direction, the second space portion with an area larger than an area of the first space portion in plan view in the first direction. The piezoelectric layer includes first and second through-holes respectively communicating with the first and second space portions, and the first through-hole has an area larger than an area of the second through-hole in plan view in the first direction.