Quartz Resonator Package Layout for Accurate Temperature Sensing
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Solution Overview
Problem
Existing resonator devices face issues with temperature differences between the piezoelectric vibration element and the thermo-sensitive component, leading to poor frequency-temperature characteristics due to adiabatic effects and air accumulation, which can result in significant frequency deviations when temperatures change.
Innovation Solution
The resonator device is designed with a specific configuration where the distance between the electrode terminals and the thermo-sensitive element is optimized (equal to or greater than 0.05 mm and less than 0.3 mm) to promote air flow, reducing temperature delays and differences, and using a thermo-sensitive element like a thermistor or temperature measuring semiconductor to accurately detect ambient temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the distance between the mounting terminal and the thermo-sensitive component is small, then the temperature difference between the piezoelectric vibration element and the thermo-sensitive component is reduced, but air accumulation causes adiabatic heating and temperature detection delays
Solution Approach 1:
A heat conduction section is introduced as an intermediary thermal pathway between the mounting terminal and the thermo-sensitive component. This heat conduction section (which may be a thermal via, thermal path, or conductive structure) enables efficient heat transfer from the piezoelectric vibration element to the thermo-sensitive component, overcoming the adiabatic isolation caused by air gaps and ensuring accurate temperature detection without requiring direct physical contact.
2Object-affected harmful factors
If the distance between the mounting terminal and the thermo-sensitive component is large, then air flow is promoted reducing adiabatic effects, but the temperature difference between the piezoelectric vibration element and the thermo-sensitive component increases
Solution Approach 1:
The heat conduction section serves as a thermal bridge that decouples the geometric distance constraint from the thermal coupling requirement. By providing a dedicated thermal pathway, the system can maintain large physical spacing (allowing air flow) while ensuring effective heat transfer through the intermediary conduction structure, thus eliminating adiabatic effects without sacrificing temperature proximity.
3Volume of moving object
If the distance from the mounting terminal to the electronic element is less than 0.05 mm, then the device size is reduced, but temperature detection accuracy deteriorates due to air accumulation and adiabatic heating
Solution Approach 1:
The heat conduction section enables miniaturization by providing an efficient thermal pathway that overcomes the adiabatic isolation inherent in sub-0.05mm spacing. This intermediary structure allows the device to maintain compact dimensions while ensuring that the thermo-sensitive component accurately detects the piezoelectric vibration element's temperature despite the minimal physical separation.
4Temperature
If heat conduction sections and wiring patterns are used to electrically connect mounting terminals to electrode pads, then temperature difference is reduced, but device complexity increases
Solution Approach 1:
The heat conduction section is merged with existing structural elements such as the substrate, mounting terminal, or electrode pad structures. By integrating the thermal conduction function into already-present components rather than adding separate dedicated heat sinks or thermal pathways, the design achieves effective thermal coupling without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces temperature differences between the resonator element and the thermo-sensitive element, thereby improving the frequency-temperature characteristic and enabling accurate temperature detection, which is essential for maintaining stable resonator performance.
Implementation Method 1
at least one of the mounting terminals and the first electrode pad are electrically connected to each other with a first heat-conduction section and a first wiring pattern
Implementation Method 2
a piezoelectric device provided with a piezoelectric vibration element
Data Source
AI summary
A quartz crystal resonator includes a quartz crystal resonator element, a thermistor, and a package base having a first principal surface and a second principal surface having an opposed surface relationship with each other, the quartz crystal resonator element is mounted on the first principal surface side, the thermistor is housed in a recessed section of the second principal surface side of the package base, a plurality of electrode terminals connected to the quartz crystal resonator element or the thermistor is disposed on the second principal surface side of the package base, and a distance in a first direction perpendicular to the first principal surface from a mounting surface of the electrode terminals to the thermistor is equal to or longer than 0.05 mm.