Stacked AW Resonator Package for Reflected Bulk Wave Suppression
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Solution Overview
Problem
Stacked acoustic wave (AW) filter circuits generate spurious bulk waves that cause signal interference and degrade device performance due to limited space for dampening structures and mechanical integrity constraints.
Innovation Solution
Implementing a stacked AW resonator package with frame and wall structures positioned to dampen selected acoustic bulk wave paths, using polymer and metal elements to suppress reflections and maintain mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If acoustic wave resonator circuits are stacked to reduce device size, then filtering capability is improved, but spurious bulk waves are generated causing signal interference
Solution Approach 1:
The patent converts the harmful spurious bulk waves into beneficial effects by using reflector structures that redirect these waves back toward the resonator circuits, where they can be re-absorbed and converted into useful signal energy, thereby improving filter performance while maintaining compact stacking
Solution Approach 2:
Reflector structures are introduced as intermediary elements between the stacked resonator circuits to manage spurious bulk waves. These reflectors act as mediators that intercept harmful waves and redirect them in a controlled manner, preventing direct interference between adjacent circuits while enabling continued stacking for size reduction
2Object-generated harmful factors
If dampening structures are added to reduce bulk waves, then signal interference is reduced, but device complexity increases
Solution Approach 1:
The reflector structures serve multiple functions simultaneously: they act as mechanical support elements for the stacked configuration, provide acoustic reflection to manage spurious waves, and contribute to the overall structural integrity of the filter assembly. This multi-functionality reduces the need for separate dampening structures, thereby limiting complexity increase
Solution Approach 2:
The patent merges the structural support function with the acoustic management function by integrating reflector structures into the stacking framework. These same structural elements that hold the resonators in place also serve to reflect and control spurious bulk waves, combining what would traditionally be separate components into a unified design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces excitation of reflected bulk waves, improving device performance by enhancing communication band-specific insertion loss and attenuation with minimal adjustments to circuit placement.
Implementation Method 1
one or more acoustic reflection suppressing structural walls supporting the cavity between the bottom side of the first substrate and the top side of the second substrate, the one or more acoustic reflection suppressing structural walls being positioned at selected positions on a back side of the first substrate to dampen selected acoustic bulk wave paths
Implementation Method 2
dampen selected acoustic bulk wave paths from the first plurality of AW resonator circuits that generate interference in signal paths
Implementation Method 3
Using a piezoelectric material as a vibrating medium, acoustic resonators operate by transforming an electrical signal wave, that is propagating along an electrical conductor, into an acoustic wave that is propagating via the piezoelectric material
Data Source
AI summary
Aspects of the disclosure relate to devices, wireless communication apparatuses, methods, and circuitry implementing bulk wave suppression in a stacked electroacoustic device. One aspect includes a first substrate comprising a first surface and a second surface, where the second surface is opposite the first surface, a first AW resonator circuit positioned on the first surface of the first substrate, a plurality of elements including a first element, where the plurality of elements are positioned on the second surface of the first substrate, and where the first element is aligned with the first AW resonator circuit, and a second substrate comprising a first surface and a second surface, where the plurality of elements are positioned on the first surface of the second substrate, and where the plurality of elements create a cavity between the first substrate and the second substrate.