Surface Acoustic Wave Delay Matching for Multi-Channel Transmission
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Solution Overview
Problem
Existing delay compensation methods in multi-channel transmission systems, such as microwave communications, require manual cable connection for delay alignment, which is technically demanding and limits device integration due to the large size of additional cables.
Innovation Solution
A delay compensation apparatus using surface acoustic wave components with multiple output ends forming an arithmetic progression, allowing for serial connection and adjustable delay compensation through a surface acoustic output selection switch, enabling precise delay matching between channels without the need for extensive cabling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual cable connection is used for delay compensation, then delay alignment between channels can be achieved, but device integration level is reduced and technical implementation becomes more demanding
Solution Approach 1:
The patent replaces the mechanical cable connection system with an electronic delay compensation system using surface acoustic wave components. Instead of physically connecting cables of different lengths to achieve delay alignment, the invention uses electronic circuits that can programmatically adjust signal delays, thereby eliminating the need for manual cable installation while maintaining precise delay alignment between channels.
Solution Approach 2:
The patent employs surface acoustic wave components that can dynamically change their delay parameters through electronic control. The delay compensation amount can be adjusted by changing operational parameters such as frequency or control signals, allowing flexible delay alignment without physical reconfiguration. This enables the system to adapt to different delay requirements by modifying electrical parameters rather than mechanical configurations.
2Reliability
If manual cable connection is used for delay compensation, then delay alignment can be achieved, but the size of the system increases due to additional cables
Solution Approach 1:
The patent substitutes physical cables with electronic delay compensation circuits based on surface acoustic wave technology. This replacement eliminates the need for additional cable length to achieve delay alignment, thereby reducing the overall system volume while maintaining the required delay compensation functionality.
3Reliability
If manual cable connection is used for delay compensation, then delay alignment can be achieved, but the requirement on technical level of implementation personnel increases
Solution Approach 1:
The patent implements an automatic delay compensation system that can detect and correct delay differences between channels without requiring manual intervention. The surface acoustic wave components automatically adjust signal delays based on detected timing differences, eliminating the need for technicians to manually calculate and install cables of precise lengths. This self-adjusting capability significantly reduces the technical skill requirement for implementation while ensuring accurate delay alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances device integration and reliability by providing flexible and accurate delay compensation with a small form factor, capable of implementing delay compensation over a large range with high precision and reduced insertion losses.
Implementation Method 1
The first channel delay unit includes a surface acoustic unit, and the surface acoustic unit includes a first surface acoustic wave component
Data Source
AI summary
A delay compensation apparatus is provided, where a surface acoustic wave component is used as a main delay component for delay compensation. A size of the surface acoustic wave component is relatively small. Therefore, the delay compensation apparatus provided in embodiments of the present invention features a relatively small size and a relatively high device integration level.