Acoustic Wave Device Wiring Space Cover Adhesion
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Solution Overview
Problem
Acoustic wave devices with piezoelectric substrates and thick wiring lines face issues of cover peeling and gap formation due to the thickness of the wiring lines, which compromises the reliability and integrity of the device.
Innovation Solution
The acoustic wave device incorporates a substrate with acoustic wave elements, first lines connected to these elements, an insulator, and a cover that seals both the acoustic wave elements and three-dimensional wiring parts, with separate wiring spaces formed between the substrate and the cover to house the wiring parts, preventing the cover from being laid over thick wiring lines and thus suppressing peeling and gap formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a cover is laid over thick portions of wiring lines, then the device structure is simplified, but the cover peels off from the substrate and gaps form between the substrate and cover
Solution Approach 1:
The patent introduces a wiring space that elevates the three-dimensional wiring part from the substrate plane into a dedicated volumetric region between the substrate and cover. This dimensional transition allows the cover to maintain full contact with the substrate surface without being obstructed by thick wiring portions, thereby preventing peeling while preserving structural simplicity
Solution Approach 2:
The patent segments the device structure into distinct functional regions: an oscillation space for acoustic wave elements, a wiring space for three-dimensional wiring parts, and a cover-substrate interface region. This segmentation isolates the thick wiring portions within the wiring space, preventing them from interfering with the cover adhesion to the substrate while maintaining overall structural integration
2Reliability
If a wiring space is formed to house the three-dimensional wiring part, then the cover peeling is suppressed, but the device complexity increases
Solution Approach 1:
The patent merges the wiring space formation into the existing device fabrication process by defining it as a region between the substrate and cover that accommodates the three-dimensional wiring parts. This integration approach allows the wiring space to serve multiple functions: housing thick wiring, preventing cover peeling, and maintaining acoustic wave element oscillation, thereby reducing overall device complexity despite the added functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the acoustic wave device by preventing cover peeling and gap formation, even with thicker wiring lines, and improves electrical characteristics by isolating corrosive substances away from the acoustic wave elements, leading to better stability and performance.
Implementation Method 1
an acoustic wave device having a piezoelectric substrate, acoustic wave elements which are provided on the piezoelectric substrate
Data Source
AI summary
A SAW device (1) comprises a substrate (3); SAW elements (10) on a first main surface (3a) of the substrate (3); first lines (intermediate lines (29) and output side lines (31)) that are disposed upon the first main face (3a) and connected to the SAW elements (10); an insulator (21) that is layered upon the first lines; second lines (a second ground line (33b) and a third ground line (33c)) that are layered upon the insulator (21) and configure three-dimensional wiring parts (39) with the first lines; and a cover (5) that seals the SAW elements (10) and the three-dimensional wiring parts (39). Wiring spaces (53), formed between the first main face (3a) and the cover (5), houses the three-dimensional wiring parts (39), without housing the SAW elements (10).