Air-Gap Acoustic Wave Component With Insulating Film Heat Path
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Solution Overview
Problem
Acoustic wave elements in electronic components, such as FBARs and SAW resonators, face challenges in heat release due to their mounting configuration across an air gap, which limits their size reduction and power durability in mobile devices.
Innovation Solution
An electronic component design where a functional element on a second substrate is mounted across an air gap from the upper surface of a first substrate, with an insulating film on the first substrate's upper surface overlapping the functional element, having a thickness greater than half the distance between the element and the substrate, facilitating heat release through the film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the functional element is mounted across an air gap on the substrate, then the electronic component achieves smaller size, but heat release performance deteriorates
Solution Approach 1:
An insulating film is introduced as an intermediary between the functional element and the substrate. This film serves dual purposes: it maintains the air gap configuration for miniaturization while providing a thermal conduction path for heat release. The film thickness is specifically designed to be more than half the distance between the functional element and substrate surface, optimizing both insulation and heat dissipation functions.
Solution Approach 2:
The insulating film performs multiple functions simultaneously: electrical insulation to prevent short circuits between the functional element and substrate, and thermal conduction to enable heat release from the functional element. This multi-functionality resolves the contradiction by allowing the air gap mounting structure to maintain both size reduction and adequate heat dissipation.
2Power
If power amplifier power is increased for higher transmission capability, then transmission power increases, but heat generation and power durability requirements increase
Solution Approach 1:
The insulating film converts the previously harmful effect of the air gap (poor heat dissipation) into a beneficial thermal conduction path. By selecting materials and thicknesses appropriately, the film transforms the insulation barrier into a controlled thermal management solution, enabling higher power operation with improved durability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the maximum temperature of the substrate by enhancing heat release from the functional element, improving the component's size reduction and power durability while maintaining transmission characteristics.
Implementation Method 1
an insulating film that is located on the upper surface of the first substrate, overlaps with at least a part of the functional element in plan view, faces the functional element across the air gap, and has a film thickness that is more than half of a distance between a lower surface of the functional element and the upper surface of the first substrate
Data Source
AI summary
An electronic component includes: a first substrate; a second substrate that includes a functional element formed on a lower surface of the second substrate, the second substrate being mounted on the first substrate so that the functional element faces an upper surface of the first substrate across an air gap; and an insulating film that is located on the upper surface of the first substrate, overlaps with at least a part of the functional element in plan view, faces the functional element across the air gap, and has a film thickness that is more than half of a distance between a lower surface of the functional element and the upper surface of the first substrate.