Acoustic Wave Substrate Stack for Parallel Heat Dissipation
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Solution Overview
Problem
Existing acoustic wave devices face challenges in efficiently releasing heat generated by the acoustic wave element, which affects their performance and efficiency.
Innovation Solution
The design incorporates a structure with dummy bumps and metal patterns that connect to multiple via wirings and terminals, allowing for improved heat release by expanding the heat dissipation area and creating parallel heat release routes, enhancing the thermal management of the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is released through a metal pattern on a multilayered substrate, then heat dissipation is achieved, but the heat release efficiency is insufficient
Solution Approach 1:
The invention divides the heat dissipation function into multiple segments: dummy bumps are separated from acoustic wave elements, each dummy bump connects to multiple via wirings, and metal patterns are distributed across multiple substrates. This segmentation creates multiple independent heat release routes, improving overall heat dissipation efficiency while distributing thermal load across the device structure.
Solution Approach 2:
The invention extends heat dissipation from a two-dimensional metal pattern on a single substrate to a three-dimensional structure involving multiple substrates stacked vertically. Heat can now dissipate through via wirings in the vertical dimension and through metal patterns on multiple substrate surfaces, effectively increasing the heat dissipation volume and thermal pathways.
2Area of stationary object
If dummy bumps are used for heat release, then heat dissipation area is expanded, but device complexity increases
Solution Approach 1:
The dummy bumps serve multiple functions: they act as heat dissipation structures, provide electrical connection points through via wirings, and maintain structural integrity between substrates. The metal patterns similarly serve both electrical interconnection and heat dissipation functions. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby managing device complexity.
Solution Approach 2:
The invention merges the heat dissipation function with existing structural and electrical components. Dummy bumps are integrated into the substrate stacking structure, and metal patterns are combined with wiring layers. This merging approach expands heat dissipation area without adding separate dedicated heat sink components, thus controlling device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the temperature of the dummy bumps and maintains isolation characteristics, ensuring efficient heat release and performance stability in acoustic wave devices.
Implementation Method 1
a first metal layer that is separated from the acoustic wave element and a wiring line connected to the acoustic wave element in the first substrate and connects the first surface and the third surface; a second metal layer that is separated from the functional element and a wiring line connected to the functional element in the second substrate and connects the second surface and the third surface; a first metal pattern that is located on the third surface, is in contact with the first metal layer and the second metal layer, and connects the first metal layer and the second metal layer
Data Source
AI summary
An acoustic wave device includes: a first substrate having a first surface on which an acoustic wave element is located; a second substrate having a second surface on which a functional element is located; a third substrate having a third surface, which faces the first and second surfaces, and a fourth surface being opposite to the third surface, a first metal layer separated from the acoustic wave element and a wiring line in the first substrate and connecting the first and third surfaces; a second metal layer separated from the functional element and a wiring line in the second substrate and connecting the second and third surfaces; a first metal pattern located on the third surface, being in contact with the first and second metal layers, and connecting the first and second metal layers; and a terminal located on the fourth surface and electrically connectable to the first metal pattern.