Acoustic Wave Electrode Cavity Structure for Radiant Heat Dissipation
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Solution Overview
Problem
Conventional acoustic wave devices suffer from degraded heat dissipation performance due to the lack of contact between the IDT electrode and the support body, leading to inefficient heat management.
Innovation Solution
Incorporating a hollow portion in the support that overlaps with the excitation electrode and features a functional film with electromagnetic-wave absorption capacity on the inner wall surface, which enhances heat dissipation by effectively absorbing and propagating radiant heat away from the piezoelectric layer and support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a hollow portion is formed in the support body to overlap with the IDT electrode, then heat dissipation performance is improved through radiant heat absorption, but the structural complexity of the support increases
Solution Approach 1:
The support body is segmented by introducing a hollow portion that divides the solid structure into regions with and without the cavity. This segmentation creates an inner wall surface that can be selectively treated with functional films to enhance heat dissipation through radiant heat absorption, while maintaining the overall structural integrity of the support.
Solution Approach 2:
A functional film with electromagnetic-wave absorption capacity is applied locally to the inner wall surface of the hollow portion, rather than treating the entire support structure. This local quality enhancement targets specifically the regions where radiant heat absorption is most effective, improving heat dissipation performance without unnecessarily increasing overall device complexity.
2Temperature
If a functional film with electromagnetic-wave absorption capacity is applied to the inner wall surface, then heat dissipation efficiency is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The functional film is applied only to the inner wall surface of the hollow portion where it is most needed for heat dissipation, rather than coating the entire support structure. This localized application reduces material costs and simplifies the manufacturing process while still achieving significant heat dissipation improvement.
Solution Approach 2:
The functional film acts as an intermediary layer between the hollow portion structure and the heat radiation. This mediator absorbs electromagnetic waves (radiant heat) and converts them to other forms of energy, enabling efficient heat dissipation from the IDT electrode region without requiring direct thermal contact with the support body.
3Adaptability or versatility
If the piezoelectric layer is not in direct contact with the support body, then device flexibility is improved, but heat dissipation performance is degraded
Solution Approach 1:
The patent replaces the traditional mechanical heat conduction path (requiring direct contact between piezoelectric layer and support) with a radiant heat transfer mechanism. The hollow portion with functional film absorbs radiant heat from the IDT electrode, enabling effective heat dissipation without relying on thermal contact, thus maintaining device flexibility while improving heat management.
Solution Approach 2:
The functional film on the inner wall surface of the hollow portion serves as an intermediary that captures radiant heat energy from the piezoelectric layer/IDT electrode region. This mediator enables heat dissipation to occur without direct thermal contact, bridging the gap between the flexible non-contact structure and effective heat management requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation performance by providing an efficient heat dissipation path even where the piezoelectric layer and support are not in contact, effectively managing heat generated during acoustic wave excitation.
Implementation Method 1
A functional film is provided on at least a portion of the inner wall surface and having an electromagnetic-wave absorption capacity in a wavelength range from about 0.2 μm to about 1.2 μm inclusive
Implementation Method 2
Emissivity of the functional film is higher than emissivity of the inner wall surface of the support
Data Source
AI summary
An acoustic wave device includes a support including a support substrate, a piezoelectric layer on the support, and an excitation electrode on the piezoelectric layer. A hollow portion is provided in the support and overlaps with at least a portion of the excitation electrode in plan view. The support includes a cavity opening on a side of the piezoelectric layer, and an inner wall surface connected to the cavity and facing the hollow portion. A functional film is provided on at least a portion of the inner wall surface and has an electromagnetic-wave absorption capacity in a wavelength range from about 0.2 µm to about 1.2 µm inclusive.