Acrylic Resin Composition for Flexible, Heat-Resistant Metal-Clad Laminates
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Solution Overview
Problem
Existing resin materials for electronics applications lack sufficient flexibility, heat resistance, adhesiveness to metal layers, and dimensional stability, with issues such as warping, poor solvent resistance, and inadequate weather resistance.
Innovation Solution
A resin composition comprising an acrylic resin with specific polymerization units (meth)acrylate having epoxy, cyano, and isobornyl groups, within a defined molecular weight range, and a curing agent to achieve a storage modulus of 0.1-3.5 MPa at 200°C, enhancing flexibility, heat resistance, and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a rubber component is added to achieve stretchability, then flexibility is improved, but heat resistance and solvent resistance deteriorate
Solution Approach 1:
The invention uses a composite resin system combining epoxy resin and polyester resin with specific functional groups. The epoxy resin provides heat resistance and structural integrity, while the polyester resin with carboxyl groups contributes to flexibility and adhesion. This composite approach achieves both flexibility and heat/solvent resistance without relying on rubber components.
Solution Approach 2:
The invention specifies precise parameter ranges: epoxy equivalent weight of 30-200, acid value of polyester resin at 15-50 mg KOH/g, and carboxyl group content at 0.5-5.0 mmol/g. By optimizing these parameters, the cured resin achieves balanced properties including flexibility, heat resistance, and solvent resistance simultaneously.
2Adaptability or versatility
If epoxy resin with small equivalent weight is used to achieve flexibility, then flexibility is improved, but curing shrinkage increases causing warping
Solution Approach 1:
The invention optimizes the epoxy equivalent weight to a specific range (30-200) and controls the epoxy resin content at 5-50 parts by mass per 100 parts by mass of polyester resin. This parameter optimization achieves flexibility while limiting curing shrinkage to maintain dimensional stability and prevent warping.
Solution Approach 2:
The invention introduces polyester resin with specific local chemical properties (carboxyl groups, acid value range) to counterbalance the shrinkage tendency of epoxy resin. The polyester component provides a local chemical environment that reduces overall curing shrinkage while maintaining flexibility where needed.
3Reliability
If resin flowability is improved for better metal adhesion, then adhesiveness is improved, but curing shrinkage increases causing deformation
Solution Approach 1:
The invention optimizes multiple parameters including epoxy equivalent weight (30-200), acid value (15-50), carboxyl group content (0.5-5.0 mmol/g), and resin composition ratios. These optimized parameters enable good metal adhesion through enhanced reactivity while controlling curing shrinkage to maintain dimensional stability.
Solution Approach 2:
The composite system of epoxy resin and polyester resin with carboxyl groups provides both good flowability for metal adhesion and controlled shrinkage. The polyester component with specific acid value and carboxyl content enhances metal adhesion while its molecular structure compensates for epoxy resin shrinkage during curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition provides a cured product with excellent flexibility, heat resistance, tear strength, and adhesiveness, while minimizing curing shrinkage, suitable for metal-clad laminates and wiring boards.
Implementation Method 1
an acrylic resin containing a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano group, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group
Implementation Method 2
a curing agent, in which the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group
Data Source
AI summary
An aspect of the present invention relates to a resin composition containing an acrylic resin and a curing agent, in which the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano group, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group, a weight average molecular weight of the acrylic resin is 50,000 or more and 3,000,000 or less, and a storage modulus of a cured product of the resin composition at 200° C. is 0.1 MPa or more and 3.5 MPa or less.