Acrylic Sealing Composition for Semiconductor Devices
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Solution Overview
Problem
Existing acrylic compositions for sealing in semiconductor devices face challenges in molding into sheets, tend to be brittle, and lack high heat resistance, especially when high amounts of inorganic fillers are added to reduce thermal expansion coefficients or improve thermal conductivity.
Innovation Solution
An acrylic composition containing a polyphenylene ether resin with radical-polymerizable substituents, an inorganic filler, a thermal radical polymerization initiator, and a thermoplastic resin, which allows for easy molding into sheets, provides flexibility, and achieves high heat resistance through polymerization and thermal curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high amounts of inorganic fillers are added to reduce thermal expansion coefficients or improve thermal conductivity, then heat resistance and thermal performance are improved, but the composition becomes difficult to mold into sheets and tends to be brittle
Solution Approach 1:
The patent uses a composite material system consisting of acrylic compound, polyphenylene ether resin with radical-polymerizable substituent, inorganic filler, thermal radical polymerization initiator, and thermoplastic resin. This composite formulation allows the composition to maintain high heat resistance from the inorganic filler while the polyphenylene ether resin and thermoplastic resin provide flexibility and ease of molding, resolving the contradiction between heat resistance and manufacturability
Solution Approach 2:
The patent changes the chemical structure parameters of the polyphenylene ether resin by introducing radical-polymerizable substituents at the terminal. This structural modification enables the resin to undergo thermal radical polymerization, transforming the physical and mechanical properties of the composition to achieve both high heat resistance and improved moldability into sheets
2Temperature
If high amounts of inorganic fillers are added to reduce thermal expansion coefficients or improve thermal conductivity, then heat resistance and thermal performance are improved, but the composition tends to be brittle
Solution Approach 1:
The patent creates a composite material where inorganic fillers provide heat resistance while the polyphenylene ether resin with radical-polymerizable substituent and thermoplastic resin provide flexibility. The synergistic combination of these components resolves the brittleness issue that would otherwise result from high inorganic filler content
Solution Approach 2:
The patent modifies the molecular structure of the polyphenylene ether resin by adding radical-polymerizable substituents, which enables thermal radical polymerization. This chemical transformation changes the material's properties to achieve both high heat resistance and maintained flexibility, preventing brittleness
3Ease of manufacture
If the composition is made flexible and easy to mold into sheets, then ease of manufacture and handling are improved, but heat resistance may be compromised
Solution Approach 1:
The patent introduces radical-polymerizable substituents at the terminal of the polyphenylene ether resin, enabling thermal radical polymerization. This chemical modification allows the material to be molded into sheets at lower temperatures while developing high heat resistance through the polymerization reaction and crosslinking structure formed during curing
Solution Approach 2:
The patent formulates a composite material where the polyphenylene ether resin with radical-polymerizable substituent serves as a matrix that provides both processability (ease of molding) and thermal stability. The inorganic filler further enhances heat resistance while the thermoplastic resin aids in molding, achieving both ease of manufacture and high heat resistance simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the production of sheet materials with moderate flexibility and high heat resistance, effectively sealing gaps between semiconductor chips and substrates while maintaining ease of molding and handling, reducing defects like unfilling and voids.
Implementation Method 1
a thermal radical polymerization initiator, and a thermoplastic resin. The acrylic composition for sealing preferably further includes a nitroxide compound.
Implementation Method 2
the acrylic composition for sealing and the bump electrodes are heated for curing the acrylic composition for sealing to form a sealing material while electrically connecting the bump electrodes to the conductor wiring
Data Source
AI summary
The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, a thermal radical polymerization initiator, and a thermoplastic resin.