Actinic-Ray-Sensitive Resin Composition for High-Resolution Lithography
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current actinic-ray- or radiation-sensitive resin compositions face challenges in achieving high sensitivity, resolution, roughness characteristics, pattern configuration, aging stability, and outgas performance, particularly when using shorter wavelength light sources or in vacuum exposure environments for semiconductor production and lithography processes.
Innovation Solution
A novel actinic-ray- or radiation-sensitive resin composition is developed, utilizing a compound that generates strong acids with inhibited diffusion, specifically designed to enhance sensitivity, resolution, and roughness characteristics, while reducing outgas performance issues, by incorporating a compound of general formula (I) which includes an optionally substituted alkylene group, a bivalent connecting group, and an organic group with 15 or more carbon atoms, along with a hydroxyl or fluoroalkylsulfonamido group.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photoacid generators are used in actinic-ray- or radiation-sensitive resin compositions, then the composition can achieve basic pattern formation capability, but the sensitivity, resolution, and roughness characteristics are insufficient for high-precision lithography
Solution Approach 1:
The patent modifies the molecular structure of photoacid generators by introducing specific structural features (compound of formula I with particular substituents and molecular weight range) to change the diffusion characteristics of generated acids. This structural parameter change enables controlled acid diffusion that improves resolution while maintaining sensitivity and roughness characteristics
Solution Approach 2:
The patent creates a composite resin composition by combining the specific photoacid generator (compound of formula I) with carefully selected resin components. This composite formulation achieves synergistic effects where the photoacid generator and resin work together to improve pattern formation quality, sensitivity, and aging stability simultaneously
2Manufacturing precision
If shorter wavelength light sources (e.g., ArF excimer laser at 193 nm) are used to improve resolution, then higher pattern resolution can be achieved, but conventional resin systems show sharp absorption and insufficient performance
Solution Approach 1:
The patent develops resin compositions with modified optical and chemical parameters specifically optimized for 193 nm ArF excimer laser exposure. The composition adjusts absorption characteristics and photoacid generation efficiency to achieve high resolution at this wavelength while maintaining adequate sensitivity
Solution Approach 2:
The patent applies local quality by creating specific functional regions within the resist composition - the photoacid generator and resin are designed to work together in a localized manner at the exposure interface, enabling precise control of acid generation and diffusion only where needed for pattern formation at 193 nm wavelength
3Manufacturing precision
If vacuum exposure is used for electron beam or X-ray lithography to achieve high precision, then pattern resolution improves, but low-boiling-point compounds evaporate and dirty the exposure apparatus
Solution Approach 1:
The patent converts the potential harm of vacuum exposure by designing a resin composition that is specifically formulated to minimize outgassing. The composition uses high molecular weight compounds and carefully selected components with low vapor pressure, transforming the vacuum environment from a source of contamination into a beneficial condition for achieving high-resolution patterning without apparatus dirtying
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved sensitivity, resolution, and roughness characteristics, while maintaining aging stability and reducing outgas performance, effectively addressing the limitations of existing resin compositions, especially in high-resolution patterning and vacuum exposure applications.
Implementation Method 1
a resist composition of chemical amplification type is a pattern forming material that is capable of, upon exposure to far ultraviolet or other radiation, generating an acid in exposed areas
Implementation Method 2
by a reaction catalyzed by the acid, changing the solubility in a developer between the areas having been exposed to actinic radiation and the nonexposed areas
Implementation Method 3
generates any of strong acids whose diffusion is inhibited
Data Source
AI summary
According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a compound that when exposed to actinic rays or radiation, generates any of acids of general formula (I) below,in whichW1 represents an optionally substituted alkylene group,W2 represents a bivalent connecting group,W3 represents an optionally substituted organic group having 15 or more carbon atoms, andZ represents a hydroxyl group or a fluoroalkylsulfonamido group having at least one fluorine atom introduced therein as a substituent.