Active Cooling of 3D Solder Contacts via Fan-Driven Airflow
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Solution Overview
Problem
Conventional semiconductor package units face challenges in continuous and stable operation due to excessive heat generation, which is not adequately dissipated, leading to potential warpage, increased failure rates, and resistance issues in the wiring board.
Innovation Solution
An electronic device with active heat dissipation is designed, featuring a wiring board, semiconductor package unit, surrounding unit, and fan modules, where the semiconductor package unit is soldered to the wiring board with three-dimensional contacts, and a surrounding unit creates a heat exchange space with fan modules and tube members to effectively cool the contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat-dissipating fins are arranged contacting the top surface of the semiconductor package unit, then heat dissipation is improved, but the three-dimensional contacts (solder balls) on the wiring board are not effectively cooled, leading to warpage, increased failure rate, and higher wire resistance
Solution Approach 1:
The heat dissipation function is segmented into two independent systems: one for the semiconductor package unit (heat-dissipating fins) and another for the three-dimensional contacts (surrounding unit with fan module). This allows each component to be cooled independently, resolving the contradiction between cooling the package unit and cooling the contacts simultaneously
Solution Approach 2:
The surrounding unit acts as an intermediary structure that directs cool air from the fan module through tube members to the three-dimensional contacts. This intermediary mechanism enables targeted cooling of the contacts without interfering with the heat dissipation from the semiconductor package unit
2Device complexity
If conventional passive heat dissipation methods are used, then device structure is simple, but continuous and stable operation cannot be ensured due to excessive heat accumulation
Solution Approach 1:
The heat dissipation system transitions from passive (static) to active (dynamic) by introducing fan modules that actively circulate air. The surrounding unit with movable air flow control enables dynamic adaptation to heat generation levels, ensuring continuous stable operation while maintaining reasonable structural complexity
Solution Approach 2:
The system uses pneumatic principles by employing fan modules to generate air flow through tube members to the three-dimensional contacts. This active air circulation mechanism provides effective cooling for continuous operation without requiring complex liquid cooling systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of warpage and failure in the wiring board, lowers aging speed, decreases wire resistance, and improves wire quality by efficiently dissipating heat from the semiconductor package unit.
Implementation Method 1
blows cool air towards the heat-dissipating fins, so as to carry the heat away from the semiconductor package unit
Implementation Method 2
The fan module is located outside the heat exchange space. The tube member is connected to the first opening and the fan module so as to allow the fan module to cool the three-dimensional contacts
Data Source
AI summary
An electronic device having active heat dissipation includes a wiring board, a semiconductor package unit, a surrounding unit, a fan module and a tube member. The semiconductor package unit is soldered to the wiring board through three-dimensional contacts. The surrounding unit is connected to the wiring board and the semiconductor package unit, and surrounds the three-dimensional contacts, such that a heat exchange space is collectively defined by the surrounding unit, the wiring board and the semiconductor package unit. The surrounding unit is provided with two openings which are in communication with the heat exchange space. The fan module is located outside the heat exchange space, and is connected to one of the openings.