Cooling/Ventilation/Heating Modifications TRIZ Cases

Three-way flow controllers switch between single-phase and two-phase fluid paths to balance plumbing wear against heat removal capacity.

Integrated cooling device support elements distribute contact pressure across power semiconductor modules.

A jet impingement cooling distributor plate uses injection and extraction ports separated by a partition wall to direct fluid flow.

Movable flow adjusting plates with variable opening areas regulate coolant distribution to resolve uneven cooling caused by varying component packing densities.

Horizontal slide rails and wheel assemblies enable horizontal translation of immersion liquid cooling tanks within a vertical rack structure.

A detachable heat dissipation module connects to an electric vehicle power converter housing via a segmented inner path for working fluid circulation.

Integrated heat transfer plate merges mechanical support with thermal conduction, eliminating bulky heatsinks and reducing device size.

A heat pipe system cools electronic components using phase transition fluids to transfer thermal energy directly outdoors.

Fan-driven airflow cools three-dimensional solder contacts, reducing wiring board warpage and failure rates caused by excessive heat.

Multi-rack door integrates air-to-liquid heat exchangers to extract heat from airflow, reducing recirculation and improving cooling efficiency.

A convex faceplate expands perforation surface area to enhance airflow across high port density communication devices.

Thermally insulated, size-adjustable conduit channels cold aisle air to rear-mounted servers, preventing overheating in dense configurations.