Module Assembly Heat Transfer Plate Integration

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing module assemblies face challenges in cost-effective and compact heat dissipation, often requiring expensive heatsinks or additional components that increase size and cost.

Innovation Solution

A module assembly design incorporating a heat transfer plate within a component housing, which is thermally engaged with a mounting frame to conduct heat away from the assembly, utilizing a thermally conductive medium to enhance heat transfer and eliminate the need for large heatsinks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional aluminum heatsinks with fins are used for heat dissipation, then heat dissipation capability is improved, but device size and cost increase

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent merges the heat dissipation function with the mounting frame by integrating a heat transfer plate directly into the mounting structure. The mounting frame serves dual purposes: mechanical support and thermal conduction pathway, eliminating the need for separate heatsink components while maintaining effective heat dissipation.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the heat dissipation function from traditional external heatsinks and integrates it directly into the mounting frame structure. The heat transfer plate is embedded within the mounting frame, removing the need for separate finned heatsink components and reducing overall device volume.

Inventive Principle:

Principle #2Taking out (Extraction)

2Temperature

If traditional aluminum heatsinks with fins are used for heat dissipation, then heat dissipation capability is improved, but device cost increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoiddevice cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent combines multiple functions into the mounting frame: mechanical mounting support and thermal conduction. This integration eliminates the need for separate heatsink components, reducing part count, assembly complexity, and overall manufacturing cost while maintaining heat dissipation effectiveness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The mounting frame is designed to perform multiple functions simultaneously: providing mechanical support for electrical components, serving as a thermal conduction pathway through the integrated heat transfer plate, and enabling heat dissipation. This multi-functionality reduces the need for additional specialized components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If convection cooling with fans is used, then heat dissipation rate is improved, but device complexity and cost increase

Engineering Contradiction:

Improveheat dissipation rateVSAvoidcooling system complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent converts the mounting frame, which is primarily a mechanical support structure, into a functional thermal conduction pathway. By integrating the heat transfer plate into the mounting frame, the structure serves dual purposes, eliminating the need for additional active cooling components like fans while maintaining effective heat dissipation.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

4Temperature

If large surface area heatsinks are used, then heat dissipation is improved, but device compactness deteriorates

Engineering Contradiction:

Improveheat dissipationVSAvoiddevice footprint

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The patent transitions from external surface area expansion (traditional heatsink fins) to internal thermal conduction through the mounting frame structure. The heat transfer plate utilizes the mounting frame's three-dimensional structure to conduct heat away from components, achieving effective heat dissipation without increasing the device's external footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The module assembly achieves effective and cost-efficient heat dissipation through conductive cooling, reducing the overall size and cost by leveraging the application mounting frame to spread heat, thereby maintaining operational efficiency.

Implementation Method 1

The heat transfer plate is in direct thermal engagement with the application mounting frame to conduct heat from the cavity to the application mounting frame by conductive of cooling

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

A thermally conductive medium is received the cavity and is positioned between the component and heat transfer plate. The thermally conductive medium transfers heat from the component to the heat transfer plate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7773379B2Module assembly having heat transfer plate

Publication Date: 2010.08.10 TE CONNECTIVITY SOLUTIONS GMBH

AI summary

A module assembly includes a component housing having a plurality of walls forming a cavity. At least one of the walls includes an opening therethrough open to the cavity. The heat transfer plate is mounted within the opening of the component housing and his exposed on an exterior of the component housing. The heat transfer plate forms at least a portion of a mounting surface of the component housing.