Jet Impingement Cooling Distributor Plate With Partition Walls
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Solution Overview
Problem
Conventional cooling technologies for electronic components, such as integrated circuits, face challenges in efficiently dissipating heat without increasing device size, especially as power demands rise, and existing jet impingement systems can be complex and costly to manufacture.
Innovation Solution
The proposed solution involves an impingement cooling device comprising a distributor plate with injection and extraction ports, a manifold with partition walls, and a heat spreader with surface features to enhance heat transfer, allowing for efficient cooling of electronic components using a modular and cost-effective design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional heat sink designs are used, then heat dissipation is achieved, but device size increases and cooling efficiency is insufficient for high power components
Solution Approach 1:
The cooling device is segmented into functionally distinct modules: a distributor plate with injection/extraction ports, a manifold with partition walls, and a heat spreader with surface features. This segmentation allows each component to be optimized independently for its specific function while maintaining overall compactness, resolving the contradiction between cooling efficiency and device size.
Solution Approach 2:
The manifold is nested within or integrated with the distributor plate structure, and the heat spreader is positioned adjacent to the distributor plate with its top surface opposing the extraction ports. This nested arrangement allows multiple functional elements to occupy overlapping or adjacent spatial volumes, achieving high cooling efficiency without increasing overall device footprint.
2Productivity
If complex jet impingement systems are implemented, then cooling performance improves, but manufacturing complexity and cost increase
Solution Approach 1:
The manifold and distributor plate are merged into an integrated structure where the manifold is coupled to the distributor plate with partition walls that separate injection and extraction ports. This merging reduces the number of discrete components and assembly steps while maintaining the complex fluid flow patterns needed for high-performance cooling, thereby reducing manufacturing complexity without sacrificing cooling performance.
Solution Approach 2:
The heat spreader incorporates localized surface features at specific locations to enhance heat transfer, rather than requiring complex geometry throughout the entire device. This localized enhancement approach achieves improved cooling performance through targeted modifications, reducing overall manufacturing complexity while maintaining high cooling efficiency where most needed.
3Power
If power consumption of electronic components increases, then computational capability improves, but heat generation increases requiring more sophisticated cooling
Solution Approach 1:
The cooling system maintains continuous cooling action through the distributor plate and manifold structure that directs cooling fluid through injection ports and extraction ports in a sustained manner. The heat spreader with its surface features continuously enhances heat transfer from the electronic component, ensuring that as power consumption and heat generation increase, the cooling system operates continuously at optimal efficiency rather than requiring intermittent or escalating cooling interventions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides effective heat dissipation for electronic components while maintaining a compact form factor and reducing manufacturing complexity, enhancing cooling efficiency and scalability.
Implementation Method 1
The heat is transferred from the IC 104 to the cooling fluid, and out of the impingement plate 120
Implementation Method 2
the heat from the IC 104 transfers through the TIM 112 to the lid 102, which then is spread out to the metal plate 110
Data Source
AI summary
An impingement cooling device including a distributor plate, a manifold, and a heat spreader. The distributor plate includes a first side, a second side opposite the first side, a plurality of injection ports extending through the distributor plate from the first side to the second side, and a plurality of extraction ports extending through the distributor plate from the first side to the second side. The manifold is coupled to the distributor plate and includes a partition wall separating the plurality of injection ports and the plurality of extraction ports on the first side. The heat spreader at least partially covers an object to be cooled and includes a top surface configured to oppose the second side of the distributor plate. The heat spreader further includes a surface feature on the top surface configured to increase heat transfer therefrom.