Inverter Cooling Device Support Structure

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Solution Overview

Problem

The existing power converters for electrically driven vehicles have high component and assembly costs due to a two-part structure of the cooling device, which requires separate manufacturing and assembly of the receiving device and cover element.

Innovation Solution

The cooling device is redesigned with support devices that distribute the contact pressure force across multiple support elements, dividing the cooling channel into partial ducts, eliminating the need for separate webs and allowing for an integral base and reduced manufacturing complexity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a two-part cooling device structure (receiving device and cover element) is used, then the cooling function is achieved, but the manufacturing complexity and assembly costs increase

Engineering Contradiction:
Improvemanufacturing complexityVSAvoidcooling device structure
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent merges the receiving device and cover element into a single integrated cooling device. The support devices are formed as one piece with the cooling channel, eliminating the need for separate manufacturing and assembly of the cover element. This integration directly reduces manufacturing complexity while maintaining the cooling function through the unified structure.

Inventive Principle:
Principle #5Merging (Combining)

2Ease of operation

If separate webs and cover elements are used to support power semiconductor modules, then the modules are properly supported, but the assembly effort and component costs increase

Engineering Contradiction:
Improveassembly effortVSAvoidnumber of components
Core Design Contradiction:
Ease of operationVSQuantity of substance

Solution Approach 1:

The support devices are integrated into the cooling device as a single component rather than being separate webs that need to be assembled. This merging of functions (support and cooling) into one component reduces the number of parts and assembly steps, directly addressing the high assembly effort and component costs.

Inventive Principle:
Principle #5Merging (Combining)

3Force

If a single rib is used to distribute contact force, then the structure is simple, but the contact force distribution is insufficient

Engineering Contradiction:
Improvecontact force distributionVSAvoidsupport structure
Core Design Contradiction:
ForceVSDevice complexity

Solution Approach 1:

The support function is segmented into multiple support devices, each with support elements that extend along the side surfaces of the power semiconductor modules. This segmentation distributes the contact force across multiple points and areas, improving force distribution while the support devices remain integrated with the cooling channel.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces manufacturing complexity and assembly effort, saving costs while maintaining effective heat dissipation for the power semiconductor modules.

Implementation Method 1

a cooling device with a cooling channel through which a cooling fluid can be guided along the bottom surface of each carrier element

Methodology Applied
Scientific EffectHeat transfer: Convection

Implementation Method 2

the underside of each support element is preferably formed by a heat sink around which the cooling fluid can flow

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentEP3589103B1Inverter for an electrically driven vehicle
Publication Date: 2022.03.02 VALEO EAUTOMOTIVE GERMANY GMBH
  • EP3589103B1 patent drawingFigure 1~2
  • EP3589103B1 patent drawingFigure 3~4
  • EP3589103B1 patent drawingFigure 5~6

AI summary

Power converter (2) for an electrically propelled vehicle (1), comprising: - three power semiconductor modules (5, 6, 7) with (i) two switching elements and (ii) a carrier element (10) having a top surface (11) on which terminals (12, 13, 14) for contacting the switching elements are arranged, a bottom surface and side surfaces, and - a cooling device (8) comprising: (i) a cooling channel (15) through which a cooling fluid can be guided along the bottom surface of each carrier element (10), (ii) a receiving device (18) in which the power semiconductor modules (5, 6, 7) are arranged side by side such that side surfaces of a pair of adjacent power semiconductor modules (5, 6, 7) face each other, (iii) a sealing device (19) and (iv) a clamping device (20) which exerts a clamping force on the sealing device (19) by clamping it to the receiving device (18), wherein the Cooling device (8) has support devices (25, 26),each of the pairs is assigned to one of the pairs and supports the pair against a bottom (27) of the cooling channel (15) when the contact force is applied, each support device (25, 26) having several support elements (28) arranged along the opposite side faces of the pair and each extending within the cooling channel (15) from the bottom (27) to the undersides of the pair.