Active Edge Thermal Dissipation for Electronic Device Cooling
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Solution Overview
Problem
Conventional electronic devices, such as tablets and notebooks, face challenges in effectively dissipating heat generated during operation without the need for active cooling systems like fans, which can impact performance and battery life.
Innovation Solution
The implementation of a passively cooled design featuring an active edge, where heat pipes or heat spreaders transfer heat from the processor to an exposed, metal active edge that allows for passive heat dissipation, and supplemental cooling is provided when the device is docked with a base, dynamically adjusting operating conditions to manage temperature and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan is provided within the computer to dissipate heat, then heat dissipation is improved, but device complexity and power consumption increase
Solution Approach 1:
The patent extracts the active cooling component (fan) from the system and replaces it with a passive cooling structure. The active edge is designed as a heat dissipation component that conducts heat away from the processor to the outer surface, eliminating the need for a fan while maintaining effective heat dissipation.
Solution Approach 2:
The passive cooling system utilizes natural heat conduction and dissipation mechanisms. The active edge structure automatically conducts heat from the processor through the housing to the outer surface, where it dissipates into the environment without requiring external power or active control systems.
2Temperature
If a fan is provided within the computer to dissipate heat, then heat dissipation is improved, but power consumption and battery life worsen
Solution Approach 1:
The patent removes the power-consuming fan from the system entirely. The active edge provides heat dissipation through passive thermal conduction, eliminating the need for electrical power to drive a cooling fan, thereby extending battery life.
Solution Approach 2:
The passive cooling system operates without consuming electrical power. The active edge structure utilizes natural heat conduction principles to transfer heat from the processor to the outer housing surface, where it dissipates into the environment through thermal radiation and convection, requiring no additional energy input.
3Temperature
If heat pipes or heat spreaders are used to transfer heat to an exposed metal active edge, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by concentrating heat dissipation functionality at the active edge location. The housing is designed with a specific active edge structure that provides enhanced thermal conduction properties at the periphery, allowing heat to be efficiently dissipated from the processor to this localized area without requiring complex heat pipes throughout the entire housing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient heat management, allowing for higher performance when docked and improved battery life when undocked, without the need for active cooling systems, while ensuring safe heat dissipation and user protection.
Implementation Method 1
heat pipes or heat spreaders transfer heat from the processor to an exposed, metal active edge
Data Source
AI summary
An electronic device is provided that includes a base, a processor, and a tablet having a front surface, a rear surface and a bottom edge surface. A processor may operate at a first operating condition when the tablet is coupled to the base, and the processor may operate at a second operating condition when the tablet is not coupled to the base. The tablet may include a heat conducting device and an active edge. The heat conducting device may conduct heat from the processor to the active edge where the heat may be dissipated using supplemental cooling.