Active Ester Resin Low Dielectric Solubility
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Solution Overview
Problem
Epoxy resin compositions struggle to achieve a low dielectric constant and dielectric dissipation factor while maintaining high solubility in solvents with low environmental impact, and exhibit high hygroscopicity.
Innovation Solution
An active ester resin is developed by esterifying an aromatic monohydroxy compound with a modified phenolic compound containing an alicyclic hydrocarbon group, using a phenylmethanol or naphthylmethanol compound, which enhances solubility in solvents like butanol and ethyl acetate, and reduces hygroscopicity of the cured product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an active ester compound is used as a curing agent to achieve low dielectric constant and dielectric dissipation factor, then the cured product has excellent insulating properties, but the resin can only be dissolved in limited types of organic solvents with high environmental impact
Solution Approach 1:
The patent modifies the molecular structure parameters of the active ester resin by introducing specific aromatic groups and controlling the ratio of phenolic hydroxyl groups to carboxyl groups. This structural parameter change enables the resin to be dissolved in environmentally friendly solvents like butanol and ethyl acetate while maintaining the low dielectric properties necessary for excellent insulating performance in high-frequency electronic devices
Solution Approach 2:
The patent creates a composite molecular structure combining modified phenolic compounds with aromatic carboxylic acid esters. This composite structure integrates the solubility characteristics of phenolic resins with the dielectric properties of aromatic esters, achieving both environmental compatibility and high-performance insulating properties in the cured product
2Temperature
If typical epoxy resin compositions are used to maintain heat resistance and insulating properties, then the cured product has excellent thermal stability, but it becomes difficult to achieve sufficiently low dielectric constant and dielectric dissipation factor for high-frequency signals
Solution Approach 1:
The patent introduces specific aromatic structural units with low polarizability into the epoxy resin matrix at localized positions. These structurally optimized units with specific aromatic groups and controlled spacing reduce the overall dielectric constant and dissipation factor of the cured product while preserving the thermal stability provided by the epoxy network structure
Solution Approach 2:
The patent optimizes the molecular weight, functional group ratio, and aromatic content parameters of the active ester resin to achieve a balance between heat resistance and dielectric properties. By controlling these parameters, the cured product attains both sufficient thermal stability for electronic components and low dielectric characteristics for high-frequency signal transmission
3Reliability
If conventional active ester resins are used to achieve low dielectric properties, then the cured product has low dielectric constant and dielectric dissipation factor, but the resin exhibits high hygroscopicity which affects long-term reliability
Solution Approach 1:
The patent converts the typically harmful hygroscopicity of conventional active ester resins into a benefit by carefully selecting aromatic groups and structural configurations that inherently reduce moisture absorption. The modified phenolic compound structure with specific aromatic substituents creates a hydrophobic effect that protects the low dielectric properties from degradation by moisture, ensuring long-term reliability in electronic applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The active ester resin achieves a significantly low dielectric constant and dielectric dissipation factor while maintaining high solubility in environmentally friendly solvents, and exhibits low hygroscopicity, making it suitable for use in electronic components and circuit boards.
Implementation Method 1
an aromatic monohydroxy compound and a modified phenolic compound obtained by modifying part or the whole of the aromatic nucleus of a phenolic compound having an alicyclic hydrocarbon group with a phenylmethanol compound or a naphthylmethanol compound are esterified with an aromatic dicarboxylic acid or a halide thereof to produce an active ester resin
Data Source
AI summary
An active ester resinhaving a molecular structure represented by Structural Formula (1)where X represents a benzene ring or a naphthalene ring, each R1 independently represents a methyl group or a hydrogen atom, k is 0 or 1, n is 1 or 2, l is 1 or 2, and m is the average of a repeating unit and from 0.25 to 1.5. The active ester resin, as a curing agent, can be combined with an epoxy resin to form at least an epoxy resin composition, a cured product, a prepreg, a circuit board and a build-up film.