Circuit Susbtrate Materials TRIZ Cases

Polyquaternium ionic hydrogel converts temperature changes into electrical signals via thermopower for flexible sensing applications.

A resin composition combines epoxy with specific acid anhydrides to achieve high glass transition temperature and low dielectric constant.

Direct electroplating of conductive vias without seed layers reduces manufacturing complexity and eliminates thermal stress on interposer substrates.

Phosphorous-containing novolac resin crosslinks with epoxy to form halogen-free flame retardant laminates.

Copolymerizing phenylvinylsilane with alkenyl compounds reduces volatility during heating, improving thermal resistance and dielectric properties.

A hollow needle creates a precise recess in an electrical insulation layer to introduce conductive viscous mass for stable contact formation.

A glass fiber composition with controlled oxide ratios enables stable fine-count filament formation.

Active ester resin combines aromatic monohydroxy compounds with modified phenolic structures to achieve high solubility in environmentally friendly solvents.

A fluororesin composition incorporating a nitrogen-containing heterocyclic compound enhances ultraviolet laser processibility.

Fluorine-containing diamines reduce residual stress in polyimide films, preventing warpage on glass substrates.

A printed circuit board design transfers LED heat directly to a metal plate through a dedicated thermal path.

A printed circuit board design with extended signal and ground pads optimizes impedance matching for high frequency transmission lines.

Chlorosilane bridges incompatible polymer phases to eliminate air inclusions and phase separation, ensuring stable dielectric properties.

A prepreg resin composition balances thermosetting and thermoplastic resins to enhance adhesion strength.

A planar substrate device stores electromagnetic energy from biological systems using single-wire antennas and capacitors.

Copolymer resin composition with unsaturated bond compounds reduces reflow warpage and thermal expansion for advanced PCB packaging.

A resin composition combining furan ring phenol novolac with cyanate compounds to form a crosslinked network structure.

Segmented adhesive layers protect conductive materials from moisture ingress and mechanical stress, ensuring long-term sensor reliability.

A polyphenylene ether resin composition incorporating a vinyl-modified resin and an organosilicon crosslinking agent with a three-dimensional network structure.

A polyphenylene ether resin composition combines triallyl isocyanurate and a metallic salt hardening promoter to form an interpenetrating polymer network.

Liquid crystalline mesogen units enable uniform inorganic filler dispersion, resolving the trade-off between low viscosity handling and high heat resistance.

A thermosetting resin composition with controlled viscosity ratio and pencil hardness fills large-diameter holes in printed wiring boards.

Aromatic epoxy resin and poly(styrene-co-maleic anhydride) form a thermosetting composition for electronic materials.

Dual membranes with apertures direct coolant flow through a connection block, resolving overheating in densely packed datacenters.

Silane-treated glass cloth bonded to modified polyphenyleneether resin resolves the trade-off between low dielectric constant and adhesive strength.

A phosphorus-containing active ester resin with aromatic and alicyclic structures serves as a curing agent for epoxy compositions.

A modified styrene-maleic anhydride copolymer hardener reacts with epoxy resin to form a crosslinked network structure.

Optimized bismaleimide resin balances low dissipation factor with high glass transition temperature.

A dicyclopentadiene modified epoxy resin composition delivers high copper foil peel strength.

Novolac epoxy resin with controlled molecular weight distribution achieves high heat resistance while maintaining flame retardancy and tracking resistance.

A fluorescent composite resin substrate enables six-plane light emission for white LEDs.

Specific polyarylate repeating units balance low water absorption and strong copper adhesion, reducing transmission loss in high-frequency circuit boards.

A resin composition combines bismaleimide and maleimide compounds to achieve photocurability.

Dissolving a PEDOT:PSS intermediary prevents substrate damage during peeling, resolving adhesion reliability issues.

Extending resin layers beyond step portions prevents interlayer peeling when flexible board regions bend, resolving rigidity and flexibility trade-offs.

A resin composition blends boron nitride and silica fillers to achieve low dielectric properties.

A thermosetting resin composition uses L*a*b* color metrics to visually distinguish semi-cured and fully cured states.

LCP substrates impregnated with thermosetting resin create ultrathin dielectric layers that maintain low dissipation factors and enable precise laser drilling.