Halogen-Free Thermosetting Compositions for Circuit Board Substrates
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Solution Overview
Problem
Existing thermosetting compositions used in electronic materials, such as circuit board substrates, face challenges in achieving optimal dielectric properties at high frequencies, while also meeting requirements for thermal stability, dimensional stability, and fire resistance without using halogenated compounds.
Innovation Solution
A thermosetting composition comprising an aromatic epoxy resin component, poly(styrene-co-maleic anhydride) component, maleimide-bearing oligomer component, benzoxazine/maleimide component, aromatic primary diamine component, microparticulate silica, organic halogen-free fire retardant component, and an effective amount of one or more catalysts, which together provide enhanced dielectric, thermal, and fire-resistant properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fire retardants (halogenated compounds) are used, then fire resistance is improved, but environmental safety and material purity are worsened
Solution Approach 1:
The patent removes harmful halogenated compounds from the fire retardant system and replaces them with halogen-free alternatives. The composition specifies 'halogen-free fire retardant' and 'halogen-free epoxy resin' to eliminate chlorine, bromine, and other halogen elements while maintaining fire resistance through alternative mechanisms.
Solution Approach 2:
The patent changes the chemical composition parameters of the fire retardant system by specifying halogen-free alternatives. The composition requires halogen-free epoxy resin (5-25 wt%), halogen-free fire retardant (5-20 wt%), and specific ratios of aromatic components to achieve fire resistance without halogenated compounds through modified chemical parameters.
2Reliability
If high aromatic content epoxy resin is used, then fire resistance and thermal stability are improved, but dielectric loss at high frequencies increases
Solution Approach 1:
The patent optimizes the aromatic content parameter within a specific range (5-25 wt% aromatic epoxy resin) rather than using high aromatic content, and balances it with poly(styrene-co-maleic anhydride) (8-30 wt%) to achieve both fire resistance and acceptable dielectric loss by carefully controlling compositional parameters.
Solution Approach 2:
The patent creates a composite resin system combining aromatic epoxy resin with poly(styrene-co-maleic anhydride) and halogen-free fire retardant. This composite approach allows the aromatic component to provide fire resistance while the styrene-maleic anhydride component helps control dielectric properties, achieving a balance between conflicting requirements.
3Reliability
If complex multi-component composition is used, then overall performance (dielectric, thermal, fire resistance) is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple functional components into a single integrated composition: aromatic epoxy resin (fire resistance), poly(styrene-co-maleic anhydride) (dielectric properties and processability), halogen-free fire retardant (fire safety), and microparticulate silica (dimensional stability). This merging provides comprehensive performance in one formulation.
Solution Approach 2:
The poly(styrene-co-maleic anhydride) component serves multiple functions: it improves dielectric properties, enhances processability, contributes to fire resistance, and aids in achieving dimensional stability. This multi-functionality reduces the need for separate additives and simplifies the overall composition design.
4Object-affected harmful factors
If halogen-free materials are used, then environmental safety is improved, but fire resistance performance is worsened
Solution Approach 1:
The patent changes the fire resistance achievement mechanism by using halogen-free fire retardant (5-20 wt%) combined with aromatic epoxy resin (5-25 wt%) and specific curing agents. This parameter change shifts from halogen-based fire suppression to alternative mechanisms while maintaining fire safety performance.
Solution Approach 2:
The patent creates a composite fire protection system using halogen-free epoxy resin, halogen-free fire retardant, aromatic primary diamine, and microparticulate silica. This composite material approach achieves fire resistance through synergistic effects of multiple halogen-free components rather than relying on halogenated compounds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent dielectric properties at high frequencies, along with good thermal stability, peel strength, and fire resistance, making it suitable for use in electronic materials without relying on halogenated compounds.
Implementation Method 1
a thermosetting composition comprising: an aromatic epoxy resin component, a poly(styrene-co-maleic anhydride) component, a maleimide-bearing oligomer component, a benzoxazine/maleimide component, an aromatic primary diamine component
Implementation Method 2
a cured (e.g., partially cured or substantially fully cured) product of a thermosetting composition as described herein
Implementation Method 3
good thermal stability
Implementation Method 4
dimensional stability
Data Source
AI summary
This disclosure relates to thermosetting compositions suitable for use in making electronic materials such as circuit board substrates, as well as cured compositions, prepregs and laminates based on such thermosetting compositions. One aspect of the disclosure is a thermosetting composition comprising: an aromatic epoxy resin component; a poly(styrene-co-maleic anhydride) component; a maleimide-bearing oligomer component; the maleimide-bearing oligomer component having an average of at least 4 maleimides per molecule, on a number average, and a softening point of no more than 100° C.; a benzoxazine/maleimide component, that is a bis(benzoxazine) subcomponent and a bis(maleimide) subcomponent, and/or a reaction product thereof; an aromatic primary diamine component; microparticulate silica; an organic halogen-free fire retardant component; an effective amount of one or more catalysts.