Interposer Via Formation Without Seed Layer
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Solution Overview
Problem
Manufacturing processes for interposers are complex and time-consuming, and the seed layer generates thermal stress, which affects the reliability of the interposer.
Innovation Solution
The interposer design omits a seed layer in the receiving through hole, using a photosensitive dielectric film and a conductive layer, where the conductive via is formed directly through electroplating, eliminating the need for sputtering and reducing process complexity and thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a seed layer is formed in the receiving through hole using conventional sputtering process, then the conductive via can be electroplated, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent removes the seed layer from the conventional manufacturing process. Instead of forming a separate seed layer through sputtering before electroplating, the invention directly electroplates the conductive via in the receiving through hole. This extraction of the seed layer step simplifies the manufacturing process while maintaining the functionality of conductive via formation.
2Reliability
If a seed layer is formed using sputtering process, then electroplating can proceed, but thermal stress is generated on the interposer
Solution Approach 1:
The patent eliminates the seed layer formation step that causes thermal stress. By directly electroplating the conductive via without preceding sputtering, the harmful thermal stress is avoided while still achieving proper conductive via formation through the electroplating process alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enhances the reliability of the interposer by preventing thermo-mechanical stress, leading to improved performance and cost efficiency.
Implementation Method 1
the conductive via is formed directly in the receiving through hole without the seed layer
Data Source
AI summary
An interposer includes an insulating substrate, a photosensitive dielectric film, a conductive layer, and a conductive via. The insulating substrate includes a bottom surface and a top surface, and defines a receiving through hole extending through the bottom surface and the top surface. The photosensitive dielectric film is mounted on the bottom surface. The photosensitive dielectric film defines a through hole spatially corresponding to and communicating with the receiving through hole. The conductive layer is mounted on an end of the photosensitive dielectric film away from the insulating substrate. The conductive layer covers an end of the through hole. The conductive via is received in the receiving through hole and the through hole. The conductive via contacts and electrically connects to the conductive layer.