PCB Linking Extended Contact Pad for Impedance Matching
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Solution Overview
Problem
Current printed circuit boards (PCBs) in wireless communication devices face challenges in assembling high-frequency signal transmission lines within limited internal spaces, particularly in wireless terminals, due to impedance mismatching and signal loss issues.
Innovation Solution
A PCB design featuring a first ground layer, dielectric layers, and a signal transmission line with strategically placed ground and signal pads, along with a slot pattern area, to optimize impedance matching and minimize signal loss while simplifying assembly and maximizing space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coaxial cable is used for high frequency signal transmission, then signal transmission capability is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent replaces the mechanical coaxial cable structure with a planar printed circuit board transmission line structure. The PCB integrates ground layers, dielectric layers, and signal transmission lines in a flat configuration, eliminating the need for three-dimensional coaxial cable assemblies and reducing overall device complexity while maintaining high frequency signal transmission capability
Solution Approach 2:
The invention transitions from three-dimensional coaxial cable geometry to two-dimensional planar PCB geometry. By arranging ground layers, dielectric layers, and signal lines in stacked planar configurations, the design achieves efficient signal transmission within the constrained space of wireless terminals without requiring the bulkier coaxial cable structure
2Volume of moving object
If FPCB is used for signal transmission, then space usage is improved, but impedance matching and signal loss performance worsen
Solution Approach 1:
The patent implements localized impedance control by varying the geometry and positioning of signal transmission lines and adjacent ground layers at different locations on the PCB. By adjusting line widths, spacing, and ground layer configurations in specific regions, the design achieves optimal impedance matching (e.g., 50 ohms) at critical interfaces while maintaining compact form factor, thereby improving both space efficiency and signal integrity
Solution Approach 2:
The invention optimizes signal transmission by carefully controlling physical parameters including dielectric layer thickness, signal line width, ground layer spacing, and material permittivity. These parameter adjustments enable precise impedance control and minimize signal loss, allowing the compact PCB design to achieve performance comparable to or better than traditional FPCB solutions
3Adaptability or versatility
If internal space is reduced to accommodate more modules, then device integration is improved, but signal transmission quality deteriorates
Solution Approach 1:
The patent utilizes vertical stacking of multiple PCB layers (ground layers, dielectric layers, signal layers) to achieve three-dimensional integration within a thin profile. This layered approach allows signal transmission paths to be routed through multiple planes while maintaining compact footprint, enabling high module density without compromising signal quality through careful control of inter-layer spacing and via hole configurations
Solution Approach 2:
The invention introduces via holes as intermediary elements to connect signal transmission lines across different PCB layers. These via structures serve as controlled impedance transitions that maintain signal integrity while enabling complex routing patterns in limited space, allowing the design to achieve high integration density without degrading signal transmission quality
Data Source
AI summary
A printed circuit board (PCB) used as a signal transmission line of a terminal, comprising a first ground layer elongating in one direction, a first dielectric layer deposited on a top of the first ground layer and elongating in the same direction as the first ground layer, a signal transmission line deposited on a top of the first dielectric layer and elongating in the same direction as the first dielectric layer, a ground pad elongating from one end of the first ground layer and in contact with an external ground, and a signal line pad extended from one end of the signal transmission line and in contact with an external signal line.